Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE SS320A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE SS320A
- Type
- SMA(DO-214AC)
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- SS320A
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Electronic Component
- BM0230264250
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS320A 产品概述
一、产品简介
SS320A 为扬杰（YANGJIE）出品的肖特基屏蔽二极管（独立式），封装为 SMA，额定整流电流 3A，直流反向耐压 200V。典型正向压降为 900mV（在 3A 条件下），具有低压降、快速恢复和良好的瞬态浪涌能力，适用于多种电源整流与保护场合。
二、主要技术参数
- 型号：SS320A（YANGJIE / 扬杰）
- 封装：SMA（表面贴装）
- 正向压降：Vf ≈ 0.9V @ 3A（典型值）
- 直流反向耐压：Vr = 200V
- 连续整流电流：I F(AV) = 3A
- 反向漏电流：Ir = 100 μA @ 200V
- 非重复峰值浪涌电流：Ifsm = 70A（短时瞬态能力）
- 工作结温范围：-55 ℃ ～ +150 ℃
三、特性与优势
- 低正向压降：0.9V 在 3A 条件下能够有效降低整流损耗，适合需要提高效率的电源设计。
- 高耐压能力：200V 反向耐压满足多数高压整流与保护场景需求。
- 良好浪涌承受力：短时峰值 70A，具备较强的抗浪涌和吸收瞬态能量能力。
- 宽温度范围：-55℃ ~ +150℃ 的结温适应工业级应用环境。
- 封装实用：SMA 封装适合表面贴装工艺，便于自动化生产和中等功率密度 PCB 布局。
四、典型应用场景
- 开关电源（SMPS）次级整流
- 电池充电器与适配器整流/保护
- 直流母线保护或极性反接保护电路
- 工业电源、高压整流与滤波应用
- 电机驱动与逆变器旁路/吸收电路
五、设计与使用建议
- 热管理：在靠近热源或连续 3A 工作时需注意散热，建议增大铜箔面积、加设散热垫或导热铜箔并合理布局热流路径。
- 布局：尽量缩短正反向电流回流路径，减小寄生感抗和热阻，必要时在焊盘下方加热散热通孔。
- 选型裕度：连续工作电流或高环境温度下建议留有裕度，避免长期临界工作导致温升和漏电流上升。
- 浪涌保护：Ifsm 为短时峰值能力，如遇频繁大浪涌（如闭合电源冲击），应配合其他浪涌抑制或限流手段使用。
- 测试与检验：关注 Vf 与 Ir 随温度变化的特性，设计中应考虑漏电流随温度上升显著增大的情况。
六、可靠性与封装说明
SMA 封装在体积与功率处理之间取得平衡，便于自动贴装与回流焊。器件在-55℃至+150℃结温范围内保持可靠工作，但在高温或高压应力下需注意长期可靠性退化，建议参照厂方数据手册进行热阻、平均功耗与寿命评估。
总结：SS320A 为一款面向中高压、3A 等级应用的肖特基二极管，兼顾较低压降与较高反向耐压，适合用于开关电源整流、保护与一般高压直流整流场合。在实际应用中请结合散热设计与工作环境做适当的余量与保护措施。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
