WMSIC Electronic Components

YANGJIE S110Q

ModelS110Q
PackageSOD-123
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE S110Q
Type
SOD-123
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
S110Q
Electronic Component
1
Package
SOD-123
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0264335744
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

扬杰S110Q整流二极管产品概述

S110Q是扬杰科技(YANGJIE)推出的小功率表面贴装整流二极管,针对高密度、小型化电子设备的低压整流需求设计,平衡了低功耗、宽温适应性与抗浪涌能力,是消费类电子、工业控制、车载系统等场景的优选器件。

一、核心参数与性能优势

S110Q的关键参数针对实用场景优化,核心性能突出:

1. 电性能参数

  • 正向压降(Vf):770mV@1A,相比传统硅整流管(典型Vf≈850mV)低约10%,导通损耗显著降低,减少设备发热,提升电源转换效率。
  • 反向耐压(Vr):直流100V,满足低压直流电路的反向阻断需求,避免反向击穿导致的电路损坏。
  • 整流电流(If):1A(直流),可稳定承载1A持续工作电流,适配中小功率电源设计。
  • 反向漏电流(Ir):1uA@100V,漏电流极低,反向截止特性优异,进一步降低待机功耗,提升电路可靠性。

2. 环境与可靠性参数

  • 工作结温范围:-55℃~+175℃,覆盖极端温度环境,适合户外、车载等温差较大的应用场景。
  • 非重复峰值浪涌电流(Ifsm):40A,可承受开机瞬间、负载突变等场景的大电流冲击,增强电路抗干扰能力,减少故障风险。

二、封装设计与适配性

S110Q采用SOD-123封装,具有明显的布局优势:

  • 紧凑尺寸:典型尺寸约2.5×1.25×1.1mm,大幅节省PCB空间,适配智能手环、蓝牙耳机等小型化设备的高密度布局。
  • 表面贴装工艺:兼容自动化贴片生产线,焊接效率高,封装采用耐高温材料,长期使用不易出现脱焊、老化问题。
  • 机械强度:封装结构坚固,可承受常规机械应力,适合批量生产与复杂安装场景。

三、典型应用场景

S110Q的参数特性匹配多领域需求,核心应用包括:

1. 小型消费类电源

如蓝牙耳机充电盒、智能手环充电器、便携式充电宝等,1A电流满足充电需求,小封装适配设备小型化设计,低Vf降低发热,提升用户体验。

2. 工业控制辅助电路

如PLC模块、传感器信号处理电路、小型电机驱动电路,宽温范围(-55~175℃)可适应工业现场的温差变化,抗浪涌能力应对开机瞬间的电流冲击,保证设备稳定运行。

3. 车载电子系统

如汽车仪表盘背光电源、胎压监测传感器电路、车载USB充电模块,符合车载级宽温要求,100V反向耐压满足车载电路的电压波动,低漏电流提升待机时长。

4. 通信终端设备

如路由器、小型基站的辅助电源模块、智能家居网关,小封装节省设备内部空间,低功耗特性适配通信设备的能效要求。

四、品牌与品质保障

扬杰科技作为国内功率半导体领域的主流厂商,S110Q的品质具备可靠保障:

  • 成熟工艺:采用扬杰自主研发的芯片设计与封装测试工艺,参数一致性好,批量产品性能稳定。
  • 可靠性测试:通过温度循环、湿度老化、浪涌冲击等严格测试,符合行业标准要求。
  • 环保合规:符合RoHS无铅环保标准,适配全球市场的环保要求。

五、选型与使用注意事项

  • 替换参考:若需替换,可选择参数相近的1A/100V SOD-123封装二极管(如某品牌XX-1A100V-SOD123),需注意封装尺寸与焊接工艺匹配。
  • 使用限制:避免超过1A持续电流、100V反向电压及40A浪涌电流的极限参数,焊接温度不超过260℃(回流焊),保证长期可靠性。

S110Q凭借紧凑封装、低功耗、宽温适应性与抗浪涌能力,成为多领域低压整流的高性价比选择,适合对体积、效率和可靠性有要求的电子设备设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.