WMSIC Electronic Components

YANGJIE BZT52B13

ModelBZT52B13
PackageSOD-123
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE BZT52B13
Type
SOD-123
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
BZT52B13
Electronic Component
1
Package
SOD-123
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0230005014
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YANGJIE BZT52B13 稳压二极管(SOD-123)产品概述

一、产品简介

BZT52B13 是扬杰(YANGJIE)推出的一款小功率稳压(锗稳压/齐纳)二极管,标称稳压值为 13V,适用于低功耗、空间受限的表贴应用。器件采用 SOD-123 封装,体积小、焊接便利,适合自动贴装和标准回流工艺。该型号面向需要稳压参考或浪涌钳位保护的低电流场景,兼顾低漏电和较宽的工作温度范围。

二、主要参数

  • 稳压值(标称):13V
  • 稳压值(允许范围):12.74V ~ 13.3V
  • 最大耗散功率(Pd):500 mW(芯片结温与环境条件相关,需要按额定条件散热)
  • 反向电流(Ir):100 nA @ 10V(低漏电,利于高阻抗电路和电池供电系统)
  • 纹波阻抗(Zzt):25 Ω(典型值,表征在规定测试条件下的小信号阻抗)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-123(表面贴装)

三、电气特性说明与工程计算

  1. 最大允许电流(在稳态):在不超过耗散功率 Pd 的条件下,最大稳态电流 Iz_max ≈ Pd / Vz。对本器件取 Vz ≈ 13V,则 Iz_max ≈ 0.5 W / 13 V ≈ 38 mA。实际设计时应留有裕量,通常保持在 Iz 的一半或更低以延长器件寿命及降低发热。
  2. 能量与功耗计算:在串联限流电阻 R 的分流式稳压电路中,R = (Vin - Vz) / Iz。器件耗散 Pd = (Vin - Vz) × Iz(加上在不导通时的漏电功耗可忽略)。例:若 Vin = 24 V、目标 Iz = 10 mA,则 R = (24−13)/0.01 = 1.1 kΩ,稳压二极管耗散 Pd = (24−13)×0.01 = 0.11 W(在安全范围内)。
  3. 纹波抑制能力:Zzt = 25 Ω 表示在小信号变化下的交流阻抗,阻抗值越低对纹波抑制越好。对于低频或小幅纹波的抑制可以通过并联旁路电容进一步改善。
  4. 漏电影响:Ir = 100 nA(在 10 V)表明在低偏置或无负载时对高阻输入电路的影响很小,适合电池供电和低待机电流场合。

四、典型应用场景

  • 小功率线性稳压/基准源:为传感器、模拟前端或参考电路提供稳定电压。
  • 浪涌/浪涌钳位:在输入过压或瞬态时限制电压,保护下游元件(需配合限流电阻或其他保护元件)。
  • 电池供电设备:低漏电适用于待机电流敏感的便携设备与物联网节点。
  • 信号钳位与电平移位:用于保护 ADC、放大器输入等敏感节点。

五、封装与热管理

SOD-123 为常见的小型表贴封装,适合批量生产与自动化贴片。由于器件额定耗散为 500 mW,热阻较大,实际使用中需注意PCB散热设计:

  • 保持接地平面或加入铜箔扩展以提高散热能力。
  • 在高环境温度或较高 Iz 工作点时进行功率降额(derating),以保证结温不超过 150 ℃。
  • 考虑脉冲或瞬态时的热冲击,避免超出器件瞬态功耗能力。

六、使用建议与注意事项

  • 设计余量:为确保长期可靠性,稳态工作电流建议远低于 Iz_max(例如 ≤ 50% Iz_max)。
  • 串联限流:在分流稳压应用中必须使用限流电阻,计算时考虑最大输入电压和最坏工作工况。
  • 并联去耦:在需要降低纹波或噪声的场合,二极管并联旁路电容(例如 0.1–10 μF)能有效改善动态响应。
  • 反向偏置与温漂:稳压点会随温度变化,关键参考应用需评估温度系数并在必要时使用温度补偿或更精确的参考源。
  • 静电与浪涌保护:表贴器件在焊接与搬运时注意静电防护(ESD),在可能的大浪涌环境下可考虑在前端增加浪涌抑制器或限流措施。

七、结论

BZT52B13(扬杰,SOD-123)是一款适用于低功耗、空间受限场合的 13V 小功率稳压二极管,特点为低漏电、较低纹波阻抗和宽工作温度范围。凭借 500 mW 的额定耗散和 SOD-123 的小封装,它在小信号稳压、输入钳位与便携设备防护等场景具有良好的性价比。实际应用时需注意热管理与合理限流,以保证稳定与可靠的长期运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.