WMSIC Electronic Components

CJ MMBT5551 H MMBT5551

ModelMMBT5551 H
PackageSOT23
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
CJ MMBT5551 H
Type
CJ
Unit
Electronic Component
Minimum package
3000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
MMBT5551 H
Electronic Component
1
Package
SOT23
Electronic Component
Transistor(BJT)
Electronic Component
0g
Electronic Component
1
Electronic Component
BM69416049
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MMBT5551 H

一、基本信息

品牌:CJ(江苏长电/长晶)
封装:SOT23
类型:NPN小信号晶体管

二、产品简介

MMBT5551 H 是一款由江苏长电制造的小信号NPN晶体管,采用SOT23封装。它主要用于低功耗和高频率的信号处理,广泛应用于各种电子设备和电路设计中。由于其良好的电气性能和适应性,MMBT5551 H 特别适合用于音频放大、开关控制、射频放大器和其他轻负载应用。

三、关键参数

  1. 最大集电极电压(Vce):50V
  2. 最大发射极电压(Ve):5V
  3. 最大集电极电流(Ic):600mA
  4. 直流增益(hFE):大约为100至600(具体取决于集电极电流)
  5. 功耗(Pd):300mW(在合适的散热条件下)

这些参数使得 MMBT5551 H 在较高的电压和电流条件下其性能表现依然稳定,适合多种电子应用。

四、特性与优势

  1. 低功耗:该部件设计为低功耗操作,使其适合便携式设备和电池供电的设计。
  2. 小尺寸:SOT23封装使得 MMBT5551 H 具有较小的占板空间,适合紧凑型电路设计。
  3. 良好的频率响应:特殊的内部结构使得其在高频应用中表现优秀,适合用于RF和音频电路中。
  4. 高增益:提供较大的增益使得在信号放大和开关应用中表现优异。

五、应用领域

MMBT5551 H 的广泛应用范围可大致汇总如下:

  • 音频放大器:能够根据输入音频信号放大输出,广泛应用于音频处理电路。
  • 开关电路:可用作晶体管开关,控制电流的开与关,适用于控制LED、继电器等器件。
  • 无线电频率(RF)放大器:在接收和发射无线电信号时,作为射频放大器使用。
  • 传感器接口:能够放大来自不同传感器的微弱信号,确保信号的有效采集。
  • 电子仪器:作为放大器、开关和信号调节器,在各种仪器中提供支持。

六、工作环境与注意事项

在使用 MMBT5551 H 时,需遵循其工作环境限制。最大工作温度通常在 -55°C 到 +150°C 之间,极端的环境会影响其功能。因此,设计人员应考虑良好的散热措施,并避免在超出规格的情况下使用,以保证器件的长期稳定性。

七、总结

总的来说,MMBT5551 H 是一款性能稳定、适用范围广泛的小信号NPN晶体管,极适合各种电子产品的设计与应用。由于其出色的电气特性、功耗性能和小巧的封装,它成为了市场上极为常见和受欢迎的晶体管之一。无论是音频放大、射频组件还是各种开关电路,MMBT5551 H 都是一个值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.