WMSIC Electronic Components

ALLEGRO A1391SEHLT-T A1391SEHLT

ModelA1391SEHLT-T
Package6-PowerWFDFN
BrandALLEGRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ALLEGRO A1391SEHLT-T
Type
ALLEGRO
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ALLEGRO
Electronic Component
A1391SEHLT-T
Electronic Component
1
Package
6-PowerWFDFN
Electronic Component
Linear Hall Sensor
Electronic Component
1.1g
Electronic Component
1.25mV/Gs
Electronic Component
1
Features
Built-in Temperature Sensor
Electronic Component
BM0257711893
Operating Temperature
20℃~+85℃
Operating Voltage
2.5V~3.5V
Operating Current
3.2mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

A1391SEHLT-T 产品概述

一、产品简介

A1391SEHLT-T 为美国 ALLEGRO(埃戈罗)推出的一款高可靠性模拟霍尔效应传感器,采用 6 引脚 PowerWFDFN(6-MLP/DFN)小型封装。器件能将外加磁场转换为与磁场强度成比例的模拟电压输出,适用于位置、接近、速度与电流感测等非接触式应用。其设计兼顾低功耗、温度稳定性与易于 PCB 布局的特点,便于直接与微控制器 ADC 接口配合使用。

二、主要电气参数

  • 灵敏度:1.25 mV/Gs(输出对磁通密度的比例系数)
  • 工作电压:2.5 V ~ 3.5 V(适合常见 3.3 V 系统)
  • 工作电流:典型 3.2 mA(低功耗特性,有利于便携或电池供电系统)
  • 工作温度范围:-20 ℃ ~ +85 ℃(工业级常用范围)
  • 输出类型:模拟电压输出(与磁场成比例,便于连续量测)

三、封装与机械特性

A1391SEHLT-T 采用 6-Power WFDFN/6-MLP(小型 DFN)封装,具有:

  • 紧凑尺寸,便于高密度 PCB 布局;
  • 外露热焊盘(exposed pad),提高热传导与接地可靠性;
  • 引脚排列利于单面贴装与自动贴片回流焊工艺。

建议在 PCB 设计时为外露焊盘提供良好焊接与多点过孔散热路径,以降低结温。

四、典型应用场景

  • 无接触位置检测(滑动位置、角度、限位开关替代)
  • 直流电机或无刷电机转速/位置检测(与磁体配合)
  • 电流检测(通过磁路感应)
  • 安全与门禁感应、齿轮/轴承磁性标记检测
  • 工业与消费类电子的接近/有无物检测

五、设计与使用建议

  • 电源旁并联 0.01–0.1 µF 陶瓷去耦电容,尽量靠近 VCC 与 GND 引脚以减小噪声。
  • 输出直接接入 MCU ADC 时,考虑在输入端添加小阻抗(如 1–10 kΩ)与 RC 低通滤波以抑制高频干扰。
  • 零磁场输出偏置应在系统中校准,若需绝对零点可采用软件标定或差分测量。
  • 对磁体极性与传感器敏感轴方向在机械设计阶段进行验证,避免测量误差。
  • 注意 ESD 与磁饱和问题:在强磁场环境下输出可能达到极限,需按应用场景选择合适磁体强度与间距。

六、可靠性与焊接注意

  • 支持常规回流焊工艺,建议遵循制造商的回流曲线以避免对封装或内部元件造成热应力。
  • 在装配与测试过程中避免对器件施加过大机械应力或弯曲 PCB,特别是裸露焊盘区域。
  • 存储与操作时遵守湿敏等级与包装要求,避免长期潮湿环境导致焊接缺陷。

七、总结

A1391SEHLT-T 以其 1.25 mV/Gs 的灵敏度、2.5–3.5 V 的低压工作范围和仅 3.2 mA 的工作电流,适合对体积、功耗和响应特性有要求的非接触磁场测量应用。紧凑的 6-MLP/DFN 封装及良好的温度范围,使其在消费电子、工业控制和汽车辅助系统等多种场景中具备很高的工程适配性。若需进一步引脚映射、典型电路或封装尺寸图,请参考 ALLEGRO 官方数据手册以获取详细制造与应用资料。

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