WMSIC Electronic Components

ALLEGRO A3930KJPTR-T A3930KJPTR

ModelA3930KJPTR-T
PackageLQFP-48-EP(7x7)
BrandALLEGRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ALLEGRO A3930KJPTR-T
Type
ALLEGRO
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ALLEGRO
Electronic Component
A3930KJPTR-T
Electronic Component
1
Package
LQFP-48-EP(7x7)
Electronic Component
BLDC Motor Driver IC
Electronic Component
0.273g
Electronic Component
1
Integrated FET
Electronic Component
Features
Motor
Electronic Component
3
Electronic Component
BM0257710281
Operating Temperature
40℃~+150℃
Operating Voltage
5.5V~50V
Driver Type
Electronic Component
Static Current(Iq)
10uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

A3930KJPTR-T 产品概述

一、产品简介

A3930KJPTR-T 是美国 ALLEGRO(埃戈罗)推出的一款三相无刷直流电机(BLDC)驱动芯片,适用于外接功率 MOSFET 的分立式功率级方案。芯片以宽工作电压和超低待机电流为显著特性,可在苛刻环境下长期稳定工作,封装为 LQFP-48-EP(7×7)并带裸露散热焊盘,便于系统级热管理与 PCB 散热设计。

二、主要参数与特性

  • 驱动类型:三相(适配三相无刷直流电机)
  • 集成 FET:否(需外部半桥 MOSFET)
  • 半桥数量:3(支持三相全桥驱动)
  • 工作电压范围:5.5 V ~ 50 V(适应宽电源范围)
  • 静态电流(Iq):约 10 μA(极低的待机功耗,利于电池供电系统)
  • 工作温度:-40 °C ~ +150 °C(Ta,满足严苛工业与汽车级温度要求)
  • 封装:LQFP-48-EP(7×7),带裸露散热焊盘(便于热流引出和焊接)

这些参数使 A3930KJPTR-T 在需要宽电压、低待机功耗和高环境适应性的无刷电机控制场景中具有竞争力。

三、功能与架构简介

作为不含集成 FET 的驱动型控制芯片,A3930KJPTR-T 的定位是作为电平、逻辑与门驱部分为外部功率级提供驱动与控制信号。典型职责包括:

  • 产生用于驱动外部半桥 MOSFET 的栅极驱动信号(需配合外置功率器件);
  • 按既定换相策略(由控制器或内部逻辑)驱动三相电机的换相通道;
  • 通过封装的散热焊盘将芯片产生的热量高效传导到 PCB,提高系统热可靠性。

由于芯片本身不集成功率器件,系统设计具有较高的灵活性:可根据功率需求并联或选型不同 Rds(on)/电压等级的 MOSFET,以达到所需电流能力与效率目标。

四、典型应用场景

  • 工业驱动:风扇、泵类、传送机构中的中小功率 BLDC 驱动;
  • 汽车电子:车内电机控制(鼓风机、电动执行器等),得益于宽温和宽压特性;
  • 消费与便携设备:对低静态功耗有要求的电池驱动系统;
  • 家电与暖通空调:模块化分立功率级方案,便于针对不同功率等级优化器件选型。

五、封装与热管理建议

LQFP-48-EP(7×7)带裸露散热焊盘,有利于热流直接通过 PCB 散出。常见建议包括:

  • 在 PCB 设计中于裸露焊盘下方布置多孔径热沉焊盘并配合多组过孔(via)直通至内部或底层铜面以提高散热能力;
  • 将高电流回路(外部 MOSFET、驱动回路)布线尽量短且低阻,GND 与电源平面采用充足铜厚;
  • 在芯片电源引脚附近布置合适容量的去耦电容(陶瓷+钽/固态)以抑制瞬态电流冲击;
  • 外部 MOSFET 的选型应关注 Vds 余量、导通电阻 Rds(on)、门极电荷 Qg 以及开关损耗,确保在 50 V 工作上有足够裕度。

六、设计注意事项与选型建议

  • 由于芯片不含集成功率 FET,需为每一路半桥选择适配的功率 MOSFET。若系统需更大电流,可并联 MOSFET,但需注意驱动能力和热均衡;
  • 静态电流极低适合省电模式,但系统级待机与唤醒策略需在整体电源管理设计中验证;
  • 在高温环境下(接近 +150 °C)运行时,要特别关注 PCB 材料、焊料及外围器件的温度等级;
  • 强烈建议在正式设计前参考官方数据手册,进行仿真与样机验证,确认换相时序、电压容限与 EMI 表现。

七、可靠性与环境适应性

工作温度范围达到 -40 °C 至 +150 °C,适配汽车级与工业级应用;宽电压覆盖 5.5 ~ 50 V,能够兼容多种电源拓扑。凭借 Allegro 的产品背景,该系列器件在磁感、驱动与汽车电子领域有较成熟的工艺与测试规范,能满足对耐久性与长期可靠性的苛刻要求。但最终系统可靠性仍依赖于合理的热设计、电气保护与外围元件选型。

备注:以上内容基于所给基础参数整理,为便于工程设计与量产,请以 Allegro 官方数据手册和技术支持资料为准并进行必要的实验验证。

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