Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ALLEGRO CT8132BV-IL4 CT8132BV
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ALLEGRO CT8132BV-IL4
- Type
- ALLEGRO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ALLEGRO
- Electronic Component
- CT8132BV-IL4
- Electronic Component
- 1
- Package
- LGA-4
- Type
- Electronic Component
- Electronic Component
- Hall Switch
- Electronic Component
- 0.144g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0264533322
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.7V~5.5V
- Operating Current
- 140nA
- Output Current
- 3mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CT8132BV-IL4 产品概述
一、产品简介
CT8132BV-IL4 为ALLEGRO（美国埃戈罗）推出的高灵敏度全极型磁性开关，基于TMR（隧道磁阻）磁感应技术，集成数字化信号处理，在工业温度范围内提供稳定可靠的开关输出。器件采用LGA-4 封装，面向板端贴装的低剖面应用。
二、主要参数与电气特性
- 工作电压：1.7 V ～ 5.5 V，适配多种低压供电系统。
- 静态工作电流：典型 140 nA，极低功耗，适合电池供电应用。
- 输出电流能力：推挽输出，最大可驱动约 3 mA 负载。
- 采样频率：2 Hz（典型），适合低速或稳态磁场检测。
- 工作温度：-40 ℃ ～ +85 ℃。
- 功能特性：欠压锁定（UVLO），防止电压不足时误触发。
三、灵敏度与磁性行为
- 工作点（吸合）：约 3 mT；释放点（脱扣）：约 2 mT，具有约 1 mT 的磁滞，确保抗抖动与稳定切换。
- 全极型（Omnipolar）响应：对磁场极性不敏感，N 极或 S 极均可触发，安装方向更灵活。
- TMR 技术提供高灵敏、低噪声的磁场检测，适合微弱磁场下可靠切换。
四、封装与工艺要点
LGA-4 底部焊盘封装，适合回流焊批量贴装。板级设计时注意焊盘尺寸与金手指布局并留意热回流曲线。器件为表面贴装，需避免强机械应力与长时间高温布局。
五、典型应用场景
- 电池供电的门磁/位置检测、便携设备开关检测；
- 家电、仪表与工业控制的低速位置或限位检测；
- 替代传统继电器/干簧管的无触点磁开关方案。
六、使用建议与注意事项
- 由于输出驱动能力为 3 mA，若需驱动更高电流负载，请增加外部缓冲驱动器或MOSFET。
- 采样频率 2 Hz 表示不适合高速磁场切换或编码器类高频检测。
- 对磁体的位置与方向进行标定，尽量将磁场轴线与器件敏感轴对准，并避免强磁干扰源靠近模块。
- 推荐在电源端加 0.1 µF 陶瓷旁路电容以抑制瞬态噪声，利用欠压锁定功能确保低电压时输出稳定。
七、总结
CT8132BV-IL4 以其超低静态功耗、TMR 高灵敏度与全极型特性，适合对功耗与灵敏度有较高要求的低速磁开关应用。LGA-4 小型封装利于现代电子产品的紧凑化设计，欠压锁定和工业级温度范围提升了在可靠性要求较高场合的适应性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
