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ALLEGRO A5976GLPTR-T A5976GLPTR
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ALLEGRO A5976GLPTR-T
- Type
- ALLEGRO
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ALLEGRO
- Electronic Component
- A5976GLPTR-T
- Electronic Component
- 1
- Package
- TSSOP-28-EP
- Electronic Component
- Stepper Motor Driver IC
- Electronic Component
- 1.2g
- Electronic Component
- 1
- H
- 2
- Features
- Built-in Charge Pump;; positions; /; Motor
- Electronic Component
- BM0264533303
- Resistor
- 220mΩ
- Operating Temperature
- 40℃~+105℃
- Interface Type
- STEP/DIR
- Voltage
- 3V~5.5V
- Electronic Component
- 2；1；16；4
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
A5976GLPTR-T 双极性步进电机驱动器产品概述
一、产品定位与核心身份
A5976GLPTR-T是美国埃戈罗（ALLEGRO）推出的双极性DMOS逻辑型步进电机驱动器，采用TSSOP-28-EP封装，专为小型步进电机的精准、高效驱动设计。产品集成DMOS功率管与逻辑控制电路，无需额外功率器件即可实现细分驱动，适用于对精度、效率及可靠性有要求的工业、办公及消费电子场景。
二、关键参数解析
（1）步进细分能力
支持2、1、16、4四种细分模式，覆盖从“整步”到“高细分”的需求：
- 1细分：适合精度要求一般、需快速响应的场景（如简单位置定位）；
- 4/2细分：平衡精度与响应速度，适配多数常规步进电机；
- 16细分：大幅提升运行平滑性与定位精度，减少振动，适合精密仪器、3D打印等场景。
（2）低导通电阻
双极性DMOS功率管的导通电阻仅220mΩ，显著降低电流损耗（公式：P=I²R），减少发热、提升效率，同时降低散热设计要求，利于设备小型化。
（3）宽温工作范围
支持**-40℃~+105℃**工业级温度范围，可稳定工作于户外、工厂车间等极端环境，无需额外温度补偿，增强系统可靠性。
（4）封装特性
采用**TSSOP-28-EP（带暴露焊盘）**封装：
- 尺寸紧凑（7.8mm×4.4mm），适配小型化设备；
- 暴露焊盘直接连接PCB散热层，大幅提升热传导效率，降低结温、延长寿命。
三、典型应用场景
A5976GLPTR-T的参数特性使其适配多种小型步进电机驱动：
- 办公设备：打印机走纸、扫描仪扫描电机驱动；
- 工业自动化：小型机械臂关节、流水线分拣机构定位；
- 消费电子：3D打印机挤出头、智能家居窗帘电机控制；
- 汽车电子：仪表盘指针、座椅调节电机（需符合汽车级认证）。
四、设计优势与可靠性
（1）双极性驱动优势
双极性电流控制实现正反方向稳定力矩输出，避免单极性驱动的力矩波动，提升电机运行平稳性。
（2）集成化设计
内置DMOS功率管与逻辑电路，无需外接功率器件，简化电路、减少PCB空间，降低系统成本。
（3）逻辑控制兼容性
支持3.3V/5V标准逻辑电平，可直接对接MCU、FPGA，便于实现动态细分调整、电流限制等智能化控制。
（4）可靠性保障
- 宽温设计：适应极端温度，减少性能波动；
- 低损耗：导通电阻小，发热少，延缓器件老化；
- 封装散热：暴露焊盘有效散发热量，避免过热失效。
五、总结
A5976GLPTR-T以多细分模式、低导通电阻、宽温范围及紧凑封装为核心优势，兼顾精度、效率与可靠性，可快速集成到各类小型步进电机驱动系统中，满足工业、办公及消费电子领域的多样化需求。
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