WMSIC Electronic Components

ALLEGRO A4910KJPTR-T A4910KJPTR

ModelA4910KJPTR-T
PackageLQFP-48-EP(7x7)
BrandALLEGRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ALLEGRO A4910KJPTR-T
Type
ALLEGRO
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ALLEGRO
Electronic Component
A4910KJPTR-T
Electronic Component
1
Package
LQFP-48-EP(7x7)
Electronic Component
BLDC Motor Driver IC
Electronic Component
0.289g
Electronic Component
1
Features
Electronic Component
Electronic Component
3
Electronic Component
BM0264549861
Operating Temperature
40℃~+150℃
Operating Voltage
3V~5.5V
Interface Type
SPI
Driver Type
Electronic Component
Static Current(Iq)
20uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

A4910KJPTR-T 产品概述

一、产品简介

A4910KJPTR-T 是美国 ALLEGRO(埃戈罗)推出的一款三相无刷电机驱动器芯片,采用 CMOS 工艺,封装为 48 引脚 LQFP 带散热焊盘(7×7 mm)。器件集成了三组半桥输出,适用于 3V 到 5.5V 的供电范围,静态电流仅 20 μA(低静态待机功耗),并通过 SPI 串行接口实现寄存器配置与状态监测。器件工作温度范围宽(-40℃ 到 +150℃),适合工业与汽车级等严苛环境。

二、主要特性

  • 驱动类型:三相 BLDC/无刷电机驱动
  • 半桥数量:3(集成六路半桥输出)
  • 工作电压:3.0 V ~ 5.5 V
  • 静态电流(Iq):约 20 μA(低功耗待机)
  • 接口类型:SPI(用于控制、配置和故障读取)
  • 工作温度:-40℃ ~ +150℃
  • 关键保护:交错导通保护(减少导通重叠、降低切换损耗)
  • 封装:LQFP-48-EP(7×7 mm,带裸露散热焊盘)

三、功能与用途(典型)

A4910KJPTR-T 面向小型三相无刷电机控制场景,适合便携设备、航空航模、风扇、泵类、车载小电机以及工业自动化中的位置/速度控制模块。通过 SPI 可实现细粒度的驱动参数配置(占空比、死区时间、开关频率等),并可在系统层进行闭环控制(配合 MCU 的速度/位置算法)。

四、封装与热管理

LQFP-48-EP(7×7)封装带中央裸露焊盘(EP),便于 PCB 层间热传导与散热。实际应用中建议在 PCB 对应焊盘下方使用多层接地/电源过孔形成散热通道,并在布局中保证电源旁有充足的去耦电容和布线厚度以降低寄生阻抗。

五、设计注意事项

  • 电源和地线应做到局部短回路与充分去耦,避免开关瞬态干扰进入逻辑侧。
  • SPI 信号与 MCU 之间应加适当抗干扰措施(阻尼、电平匹配)。
  • 合理设置死区时间与导通策略,利用交错导通保护功能以降低导通冲突风险。
  • 在高应力工况需关注器件热耗并评估 PCB 散热能力,必要时增加风冷或散热片。
  • 在系统开发早期,通过短路测试与故障注入验证保护策略与故障响应。

六、总结

A4910KJPTR-T 以低静态功耗、宽工作温度和 SPI 可编程能力为特点,适合对尺寸、能耗和可靠性有较高要求的三相无刷电机控制应用。其 LQFP-48-EP 封装兼顾可装配性与散热性能,是需要精细控制与系统级保护的嵌入式驱动解决方案。欲获取完整电气参数、寄存器定义和典型应用电路,请参考 ALLEGRO 官方数据手册与应用说明书。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.