WMSIC Electronic Components

ALLEGRO A4984SLPTR-T A4984SLPTR

ModelA4984SLPTR-T
PackageTSSOP-24-EP
BrandALLEGRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
ALLEGRO A4984SLPTR-T
Type
ALLEGRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ALLEGRO
Electronic Component
A4984SLPTR-T
Electronic Component
1
Package
TSSOP-24-EP
Electronic Component
Stepper Motor Driver IC
Electronic Component
0g
Electronic Component
1
H
2
Electronic Component
BM0257712309
Voltage
3V~5.5V
Output Current
2A
Electronic Component
Electronic Component
Electronic Component
4000
Motor Driver Voltage(Vm)
8V~35V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

A4984SLPTR-T 产品概述

一、产品简介

A4984SLPTR-T 为美国 ALLEGRO(埃戈罗)推出的全集成步进电机驱动芯片,采用 DMOS 工艺,针对双极性步进电机驱动而设计。器件将逻辑控制与功率驱动级合并于单芯片解决方案,适用于通用步进控制场景,支持多种细分分辨率并可在宽电压范围内稳定工作。

二、主要参数

  • 电机类型:双极性步进电机
  • 负载电压:8 V ~ 35 V
  • 供电电压(逻辑):3 V ~ 5.5 V
  • 输出电流:最高 2 A(每相,受散热限制)
  • 步进分辨率:全步、1/2、1/4、1/8(由细分引脚设置)
  • 输出配置:四个半桥(构成两路 H 桥)
  • 封装:TSSOP-24-EP(表面贴装,带散热焊盘)
  • 工作结温:-20 °C ~ +150 °C(Tj)
  • 应用场景:消费类、工业通用运动控制与位置控制

三、关键特性

  • 全集成控制与功率级,芯片内置电流调节机制,便于恒流驱动步进电机
  • 支持多档微步细分,提高运动平滑性与定位精度
  • 逻辑电平接口,易与微控制器或运动控制器直接连接
  • 工业级结温范围,适应恶劣环境的温度要求
  • TSSOP-24-EP 封装带中央散热焊盘,利于 PCB 热管理与散热设计
  • 可靠性设计(常含热关断、过流保护、欠压锁定等保护机制),提高系统稳健性

四、应用与设计注意事项

  • 散热:2 A 输出受封装散热能力限制,设计 PCB 时应充分利用封装底盘焊盘并增加铜箔/热过孔或散热片,以保持芯片结温在安全范围内。
  • 去耦与滤波:在电源近端布置低 ESR 去耦电容(如 10 μF+0.1 μF 组合),在驱动电源处加入合适的续流和吸收元件,以抑制瞬态电压尖峰。
  • 电流设定:采用外部电流检测电阻配合芯片内部电流调节,可以精确限制线圈电流,避免过热与电流冲击。
  • 布局:功率回路走线短而粗,逻辑地线独立,避免高电流回路干扰逻辑控制。
  • 微步选择:更高细分带来更平滑输出但需评估驱动器与电机在低速扭矩与谐波下的表现,结合系统精度与响应需求进行取舍。

五、适用场景与总结

A4984SLPTR-T 适合需要中等电流(<=2 A)、宽工作电压和多档微步控制的嵌入式运动控制应用,如 3D 打印、桌面机械、自动化设备和消费电子的定位单元。其全集成的功率与逻辑级设计、标准的 TSSOP-24-EP 封装以及工业级工作温度,便于加速原型开发并在批量产品中实现可靠的步进控制。设计时关注散热与电源完整性,可获得稳定可靠的长期运行。

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