WMSIC Electronic Components

AVAGO HCPL-0600-500E

ModelHCPL-0600-500E
PackageSO-8
BrandAVAGO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AVAGO HCPL-0600-500E
Type
AVAGO
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AVAGO
Electronic Component
HCPL-0600-500E
Electronic Component
1
Package
SO-8
Electronic Component
Logic Output Optocoupler
Electronic Component
0.38g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
15kV/us
Electronic Component
10Mbps
Features
Output; Collector Output
Electronic Component
BM0017948588
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V
Type
AC,DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL-0600-500E 产品概述

HCPL-0600-500E是由安华高(AVAGO,现为Broadcom的一部分)推出的一款高性能逻辑输出光耦合器。这款器件特别设计用于需要电气隔离和信号传输的应用场合,广泛应用于工业控制、自动化、通讯设备以及电源管理等领域,以满足现代电子设备对安全、稳定性和可靠性的日益要求。

1. 基本特性

HCPL-0600-500E具备以下几个主要特性:

  • 工作电压范围:该光耦支持4.5V至5.5V的直流输入电压范围,这使得其适用于多种供电环境,灵活性极强。

  • 高隔离性能:HCPL-0600-500E的输入端与输出端之间的绝缘电压可达到3.75kV(有效值),能够有效防止高压对控制电路造成的风险,并确保信号以安全、稳定的方式进行传送。

  • 快速响应速度:该器件具有5kV/us的信号耦合速度,使其能够支持高频率的快速信号传输,对于现代数字电路和高速通信系统尤为重要。

  • 小型封装:采用8-SO Tall封装,HCPL-0600-500E提供了紧凑的设计,适合空间有限的应用场合,同时也便于实现高密度的电路设计。

2. 应用场景

由于其卓越的性能,HCPL-0600-500E被广泛应用于多个领域:

  • 工业控制系统:在PLC(可编程逻辑控制器)和DCS(分布式控制系统)中作为信号隔离器,可以有效保护下游电路和设备免受噪声和电压波动的影响。

  • 电源管理:在开关电源、逆变器等电源管理设备中,HCPL-0600-500E能够提供高隔离度的反馈信号,从而提高系统的可靠性和稳定性。

  • 通信设备:在数据传输和处理设备中,作为输入信号的隔离和转换元件,HCPL-0600-500E能够确保信号在高频时的完整性和准确性。

  • 医疗设备:由于其高电隔离特性,使得HCPL-0600-500E能够使用于许多需要高安全性和可靠性的医疗电子设备中。

3. 设计考虑

在设计电路时,使用HCPL-0600-500E时需要考虑以下因素:

  • 输入/输出电压和功率:保证在额定电压下操作,以确保器件在安全范围内工作,并避免因过载导致损坏。

  • 温度范围:保持工作的环境温度在器件规定的范围内,可以提高器件的长期可靠性。

  • PCB设计:在布线时需考虑信号线的布局,以减少信号延时和干扰。

4. 结论

HCPL-0600-500E凭借其优良的性能指标,成为了一款理想的选择,特别适合需要电气隔离和高速信号传输的应用。安华高(AVAGO)作为全球知名的电子元器件制造商,持续为市场提供高品质、高性能的解决方案,HCPL-0600-500E则是其产品线中不可或缺的重要组成部分。无论是在工业、通讯还是医疗领域,该器件都能够为用户提供可靠的支持,推动各类电子产品向更高的技术标准发展。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.