WMSIC Electronic Components

AVAGO HCPL-354-000E

ModelHCPL-354-000E
PackageSMD-4
BrandAVAGO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AVAGO HCPL-354-000E
Type
AVAGO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AVAGO
Electronic Component
HCPL-354-000E
Electronic Component
1
Package
SMD-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.115g
Electronic Component
1
Electronic Component
3us
Features
Integrated LED
Electronic Component
BM0264467225
Operating Temperature
55℃~+100℃
Load Voltage
35V
Type
AC,DC
Output Current
50mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL-354-000E 产品概述

一、产品简介

HCPL-354-000E 是 AVAGO(安华高)系列的一款单通道晶体管输出光电耦合器,采用 SMD-4 封装,提供高达 3.75 kVrms 的输入输出隔离能力。器件内部集成反并联 LED,支持 AC 与 DC 驱动输入,适用于要求高隔离、快速响应及中等功率开关的场合。

二、主要特性

  • 输入类型:AC / DC(集成反并联 LED,便于双向或交流信号传输)
  • 输出类型:光电三极管(晶体管输出)
  • 正向压降 Vf:约 1.2 V(标称)
  • 输出电流:最高 50 mA
  • 隔离电压 Vrms:3.75 kV(耐压等级,符合安全隔离要求)
  • 负载电压:最高 35 V
  • 集电极-发射极饱和电压 VCE(sat):典型 100 mV(在规定工作点下)
  • 上升/下降时间:tr ≈ 4 μs,tf ≈ 3 μs
  • 工作温度范围:-55 ℃ ~ +100 ℃
  • 电流传输比(CTR):最小 20%,最大(饱和值)400%
  • 总功耗 Pd:170 mW
  • 正向电流 If:最高 50 mA

三、典型应用

HCPL-354-000E 适合用于电源隔离检测、开关电源反馈、微控制器接口隔离、工业控制信号隔离、测量仪表和电力电子保护电路等场景。集成反并联 LED 使其在交流信号或双向传输时更加方便可靠。

四、优势与选型建议

  • 高隔离电压(3.75 kVrms)适合需要强化安全隔离的系统,能有效防止高压侧故障传播。
  • 低 VCE(sat) 与较大的允许输出电流使其在开关驱动和功率控制反馈中表现良好,降低功耗及发热。
  • 宽温度范围与 SMD 封装便于在工业环境和自动化装配中使用。
  • CTR 范围较宽,选型时注意工作 If 与负载 IC 的匹配,必要时参考具体器件的 CTR 曲线以保证可靠传输。

五、使用注意事项

  • 在高电压隔离应用中,遵循 PCB 爆破电压、爬电距离和固有绝缘要求,确保实际系统满足安全标准。
  • CTR 会随温度、If 和老化变化,设计时预留裕量,必要时做冗余或校准。
  • 输出电流接近 50 mA 时应关注器件功耗与散热;Pd 上限 170 mW,必须在允许范围内工作。
  • 若用于高速信号,注意器件的上升/下降时间为微秒级,非适用于 MHz 级高速传输。

六、封装与安装建议

SMD-4 小型贴片封装便于自动化贴装与回流焊工艺。焊盘设计与热释散布局应参考制造商推荐,以保证长期可靠性与热性能。安装时注意方向性和走线隔离,避免高压侧与低压侧走线靠近导致漏电或爬电问题。

如需进一步的电气特性曲线、引脚定义或应用电路图,请参阅官方数据手册或提供具体应用条件以便给出更详细的设计建议。

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