Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
AVAGO HFBR-1521Z
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- AVAGO HFBR-1521Z
- Type
- AVAGO
- Minimum package
- 40 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- AVAGO
- Electronic Component
- HFBR-1521Z
- Electronic Component
- 1
- Electronic Component
- 660nm
- Type
- Fiber Optic
- Electronic Component
- Fiber Optic Transceiver
- Electronic Component
- 30m
- Electronic Component
- 3.35g
- Electronic Component
- 1
- Electronic Component
- 5MBd
- Electronic Component
- BM69416285
- Operating Temperature
- 0℃~+70℃
- Electronic Component
- Electronic Component
- Electronic Component
- 40
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HFBR-1521Z 产品概述
1. 概述
HFBR-1521Z 是由安华高（AVAGO，现在属于博通公司）生产的一款高性能光纤发射器，特别设计用于满足各种高速数据传输应用的需求。这款发射器采用表面贴装（SMD）封装，方便在现代电子电路设计中实现高密度布局。HFBR-1521Z 的设计旨在提供卓越的光电性能，使其广泛应用于计算机网络、通信设备及工业自动化等领域。
2. 主要特点
- 高带宽性能：HFBR-1521Z 能够支持高达 10 Mbps 的数据传输速率，适合要求较高的数据传输需求。
- 低功耗设计：该发射器具有卓越的低功耗特性，使其在持续运行情况下减少能量消耗，从而提高系统的整体能效。
- 宽工作温度范围：HFBR-1521Z 的工作温度范围为 -40°C 到 +85°C，适用于各种工业和户外环境，能够保持良好的性能。
- 优异的可靠性：该发射器的设计考虑到了噪声和干扰的影响，能够在多种复杂的电气环境中稳定工作。
3. 结构和接口
HFBR-1521Z 采用了紧凑的 SMD 封装形式，便于自动化焊接和集成到现有的电路板中。其引脚排列设计合理，便于快速安装和电气连接，减少生产过程中的复杂性。发射器内部使用高品质的光学材料，以确保光信号的有效发射和传输。
4. 应用场景
由于 HFBR-1521Z 的高性能特点，它被广泛应用于以下领域：
- 计算机网络：在局域网（LAN）和广域网（WAN）中，用于光纤通信以保证高速数据传输。
- 通信设备：支持各种光纤通信协议，以满足不同工业标准的网络设备。
- 工业自动化：在机器人和自动化设备中，用于实时数据的传输与监控。
- 家居和办公设备：在智能家居系统和办公自动化设备中的数据传输。
5. 性能规格
HFBR-1521Z 的一些关键性能参数如下（具体参数应参考产品数据手册以获得最新信息）：
- 工作电压：适应的电源电压范围通常在 3V 到 5V 之间，满足大多数电子设备的要求。
- 发射波长：发射器通常工作于 850nm 波长范围，以确保最佳的光纤兼容性。
- 数据传输率：最高可支持 10Mbps 的数据速率，适应现代高速通信需求。
6. 竞争优势
HFBR-1521Z 的设计与性能使其在市场上具备显著的竞争优势。与市场上其他同类产品相比，它提供了更高的数据传输速度和更广的温度适用范围。同时，其低功耗特性为应用在电源受限的环境中提供了良好的解决方案。
7. 结论
总的来说，HFBR-1521Z 是一款功能强大、性能可靠的光纤发射器，适合各种应用需求。无论是在高性能计算还是在日常的网络通信中，它都展现出优异的表现。随着光通信技术的不断发展，其市场需求预计也将持续增长，因此 HFBR-1521Z 的使用前景广阔，值得相关企业和工程师关注与应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
