WMSIC Electronic Components

ARTERY AT32F435CGU7

ModelAT32F435CGU7
PackageQFN-48(6x6)
BrandARTERY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ARTERY AT32F435CGU7
Type
ARTERY
Minimum package
4900 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ARTERY
Electronic Component
AT32F435CGU7
Electronic Component
1
Package
QFN-48(6x6)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.521g
CPU
ARM Cortex-M4F
I / O
39
RAM
384KB;512KB
Electronic Component
1
Electronic Component
BM0256324516
Operating Temperature
40℃~+105℃
CPU
288MHz
Electronic Component
Electronic Component
Electronic Component
4900

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT32F435CGU7 产品概述

一、产品简介

AT32F435CGU7 是雅特力(ARTERY)推出的一款高性能 32 位微控制器,基于 ARM Cortex-M4F 内核,集成浮点单元(FPU)与 DSP 指令集,面向需要高实时运算能力与丰富资源的嵌入式应用。该器件在性能、存储与工业级工作温度上具有良好平衡,适合工业控制、运动控制、音频处理和边缘计算等场景。

二、核心规格(关键参数)

  • CPU 内核:ARM Cortex-M4F(带浮点运算单元)
  • CPU 最大主频:288 MHz
  • 程序存储容量(Flash):1 MB
  • RAM 容量:384 KB / 512 KB(根据版本/封装可能有所区分)
  • I/O 数量:39 个通用 I/O 引脚
  • 工作温度范围:-40℃ ~ +105℃(工业级)
  • 品牌:ARTERY(雅特力)
  • 封装:QFN-48(6 x 6 mm)

三、关键特性与优势

  • 高性能计算:Cortex-M4F 内核与硬件浮点单元使得该器件在数字信号处理、滤波算法和控制回路中表现优异,能够在较低延迟下完成复杂运算。
  • 大容量存储:1 MB 的程序存储与 384/512 KB 的 RAM 为中大型固件、复杂协议栈及运行时数据提供充足空间,减少外部存储依赖。
  • 丰富 I/O 与外设扩展能力:39 个通用 I/O 适配多种外设接口及传感器连接,便于系统集成与外围电路布局。
  • 工业级可靠性:-40℃ 到 +105℃ 的工作温度覆盖多数工业与车规附近应用,对温度变化的适应性强。
  • 紧凑封装:QFN-48(6×6)封装在保证引脚数的同时体积小,便于体积受限的终端产品设计。

四、典型应用场景

  • 工业控制与驱动:高速控制回路、PID 算法与传感器数据融合。
  • 电机与伺服控制:利用浮点运算与 DSP 指令对电机控制算法进行实时运算。
  • 音频与信号处理:滤波、混音与音频特效等对浮点性能有需求的场合。
  • 物联网网关与边缘节点:在本地完成数据预处理、协议解析与安全功能,减轻云端负担。
  • 智能家电与消费电子:对性能与功耗有较高平衡要求的嵌入式系统。

五、封装与工程注意事项

  • QFN-48 热设计:QFN 底部焊盘建议按厂商推荐布局,做好散热与地平面连接,保证长期可靠性。
  • 电源与去耦:高速内核对电源噪声敏感,建议在电源引脚处放置高频与大容量去耦电容,并优化电源走线。
  • PCB 布局:高速信号与模拟回路应分区隔离,关键信号走线短且成对,以降低干扰与串扰。
  • 调试与芯片引脚:预留 SWD/JTAG 调试接口与最小外设(复位、时钟)以便开发与维护。
  • 温度与可靠性验证:在目标环境进行加速寿命与温度循环测试,确保在 -40℃ ~ +105℃ 范围内稳定运行。

六、小结

AT32F435CGU7 以 ARM Cortex-M4F 的强大实时计算能力、充裕的闪存与内存资源、39 路 I/O 以及工业级温度范围,提供了兼顾性能与可靠性的嵌入式计算平台。其紧凑的 QFN-48 封装适合空间受限的产品设计,适用于工业控制、电机驱动、音频处理与智能边缘等多类应用。设计时合理考虑电源去耦、散热与布局细节,将有助于发挥器件性能并提升系统稳定性。

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