WMSIC Electronic Components

BORN BC817-40

ModelBC817-40
PackageSOT-23
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BC817-40
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BC817-40
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264595474
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC817-40 产品概述

一、产品简介

BC817-40(BORN伯恩半导体,SOT-23封装)为通用型NPN硅双极型晶体管,适用于开关和小信号放大场合。器件在紧凑的SOT-23封装中提供可靠的电流驱动能力与较高的击穿电压,便于表面贴装和批量生产使用。

二、主要规格参数

  • 晶体管类型:NPN
  • 集电极电流(Ic):500 mA(最大)
  • 集-射击穿电压(Vceo):45 V
  • 功耗耗散(Pd):300 mW(SOT-23,环境及布线不同需查阅datasheet)
  • 直流电流增益(hFE):100(典型)
  • 特征频率(fT):100 MHz
  • 集电极截止电流(Icbo):100 nA(典型)
  • 集电极饱和电压(VCE(sat)):700 mV(典型,具体随Ib/Ic比变化)
  • 射基极击穿电压(Vebo):5 V
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:SOT-23
  • 数量:1 个 NPN

三、封装与引脚

SOT-23 小型封装适合表面贴装,常见引脚排列(请以实际封装图为准):引脚1:基极(B),引脚2:集电极(C),引脚3:发射极(E)。SOT-23利于密集布线,但受限于散热能力,建议在PCB上配置适量铜箔并靠近地/电源平面以提升散热。

四、主要特性与优势

  • 兼顾开关与小信号放大:45 V 的Vceo允许在中等电压环境工作,Ic达500 mA适合驱动小型负载。
  • 高频响应良好:fT≈100 MHz,适合音频到低射频的小信号放大与缓冲。
  • 低泄漏与稳定工作:Icbo约100 nA,适合高阻输入及低漏电要求的电路。
  • 小型化与SMT兼容:SOT-23封装便于自动化贴装,适合消费电子与工业控制模块。

五、典型应用

  • 低功耗开关控制与驱动(小型继电器、指示灯、传感器信号放大)
  • 低电压信号放大器与驱动级
  • 电平转换、缓冲器与前端放大
  • 消费电子、通信终端、仪表与嵌入式控制电路

六、热管理与使用建议

SOT-23 封装的300 mW 耗散受PCB铜面积与环境温度影响明显。使用时应注意:

  • 在靠近或超过25 ℃ 的环境中按厂商给出的温度降额曲线计算允许功耗;
  • 对于持续较大集电极电流(接近或超过100 mA)场合,应增加散热铜箔、过孔或选择更大封装器件;
  • 作为开关使用时,确保基极限流电阻合适以保证进入饱和又不超载基极;估算基极电流可按 Ib ≈ Ic/(hFE_sat),hFE_sat通常远小于直流增益hFE。

七、选型与替代建议

BC817-40 适合需要中等电流与中等电压规格的小型化电路。若需要更高功耗处理或更低饱和压,可考虑更大封装或专用功率晶体管;若需更高增益或频率性能,可寻找fT更高或hFE更大的替代型号。最终选型请以完整datasheet为准,并核对典型工作条件下的VCE(sat)、hFE曲线与温度特性。

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