WMSIC Electronic Components

BORN BDFN2C4R51V50

ModelBDFN2C4R51V50
PackageDFN1006-2(SOD-882)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BDFN2C4R51V50
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BDFN2C4R51V50
Electronic Component
1
Package
DFN1006-2(SOD-882)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
90pF
Electronic Component
BM0264583392
Voltage
5.5V;13V;7.5V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA
Voltage(VBR)
4.7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BDFN2C4R51V50 产品概述

一、产品简介

BDFN2C4R51V50 为 BORN(伯恩半导体)推出的双向 TVS 抑制器,采用 DFN1006-2(SOD-882,等同 0402)超小封装,专为 5V 类电源与接口电路提供高效的瞬态过压和静电放电保护设计。器件为双向结构,工作稳态电压 Vrwm = 4.5V,击穿电压 VBR ≈ 4.7V,适合用于 USB、充电与小型模块的防护场景。

二、关键电气参数

  • 极性:双向(Bi‑directional)
  • 反向工作电压 Vrwm:4.5V
  • 击穿电压 VBR:4.7V(典型)
  • 钳位电压:在不同脉冲电流条件下典型钳位值为 5.5V、7.5V 和 13V(随脉冲强度上升而增加)
  • 峰值脉冲电流 Ipp:40A(8/20µs)
  • 峰值脉冲功率 Ppp:500W(8/20µs)
  • 反向漏电流 Ir:100nA(常温下典型)
  • 结电容 Cj:约 90pF
  • 防护等级:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)规范

三、性能特点与优势

  • 超小封装(DFN1006-2/0402)占板面积极小,利于高密度设计与便携产品应用。
  • 双向保护结构,适合正负脉冲或交流耦合信号线防护,无须区分极性。
  • 高能量吸收能力(500W@8/20µs)与高峰值电流能力(40A)保证设备在强干扰场景下仍能有效保护下游器件。
  • 低静态漏电(100nA)对电源效率影响较小,适合便携电池供电系统。
  • 满足多项 IEC 工业抗扰度标准,能抵御常见的静电放电和浪涌冲击。

四、典型应用场景

  • 5V 电源轨与 USB/OTG VBUS 保护:Vrwm = 4.5V 与 5V 系统匹配良好。
  • 小型消费电子:移动设备、可穿戴、蓝牙模组等需占板面积小且抗ESD的产品。
  • 通讯与接口保护:针对需要双向浪涌/静电保护的串行或差分接口(在允许的结电容范围内)。
  • 工业控制与测量仪器的瞬态抑制。

五、设计与使用建议

  • 布局:TVS 尽量靠近被保护的接口或电源入口放置,走线短且粗,接地回路应尽可能低阻抗;若为多层板,建议靠近接地平面打过孔增强散热与回流。
  • 对高速信号慎用:本器件结电容约 90pF,可能影响高频和高速差分信号(如高速 USB/PCIe)完整性;如用于高速通道,请评估对信号影响或选用低容型 TVS。
  • 热与封装考量:0402/DFN1006-2 封装便于贴片生产,但在重复大能量冲击下需要考虑焊点与基板的热管理。
  • 合理选型:若系统需要更低钳位电压或更小结电容,可对比其他系列或单向器件;若保护更高能量冲击,可并联或选择更高功率等级产品。

总结:BDFN2C4R51V50 以其小尺寸、双向保护和较强的脉冲能量吸收能力,适合用于 5V 供电与一般接口的 ESD/浪涌保护场合。在 PCB 布局与高速信号兼容性上需注意结电容带来的影响,按上述建议布线与选型可取得良好的保护效果。

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