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BORN DSS16
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN DSS16
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- DSS16
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.044g
- Electronic Component
- 1
- Electronic Component
- BM0264491106
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 100uA@60V
- (Vf)
- 850mV@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSS16 产品概述
一、主要参数
DSS16（BORN 伯恩半导体）为一只 1A/60V 肖特基整流二极管，封装为 SOD-123FL。关键电气参数如下：
- 二极管配置：1 个独立式
- 正向压降：Vf = 850 mV @ 1 A
- 直流反向耐压：Vr = 60 V
- 最大整流电流：IF = 1 A（连续）
- 反向漏电流：IR = 100 µA @ 60 V
- 工作结温范围：Tj = -55 ℃ ~ +125 ℃
- 非重复峰值浪涌电流：IFSM = 30 A（单次浪涌）
- 描述：1A 60V 肖特基，品牌 BORN（伯恩半导体），封装 SOD-123FL
二、产品特性
- 低正向压降（Vf 850 mV @1 A）有助于降低导通损耗，提升功率转换效率。
- 肖特基结构带来较快的开关速度与较低的反向恢复时间，适合高频电源与开关整流场合。
- 小型 SOD-123FL 封装适合表面贴装工艺，利于高密度电路设计与自动化生产。
- 耐压 60 V 适用于常见的中低压直流系统，反向漏电流在 60 V 时为 100 µA，适合多数低功耗应用，但对极低漏电要求应谨慎选型。
- 峰值浪涌 30 A 能够承受启动或短时浪涌电流，但持续工作应遵循额定连续电流限制与热管理要求。
三、典型应用
- 开关电源整流、反向二极管（free-wheeling）
- 备用电源与电池反接保护、电源路径选择
- DC-DC 转换器输入输出整流
- 汽车电子（低压子系统）、工业控制与通信电源模块
- 各类便携设备的快速整流与保护电路
四、使用与封装注意事项
- SOD-123FL 为小封装，热阻较高，长时间靠近额定电流（1 A）时需通过增加 PCB 铜面积（散热铺铜、过孔）或外部散热措施来降低结温。
- 单次浪涌能承受 IFSM = 30 A，但不得作为长期超载工作依据。遵循 PCB 布局与环境温度限制，确保结温不超过 125 ℃。
- 在高反向电压和高温度条件下，反向漏电流可能上升，需根据系统的漏电容忍度评估。
- 焊接工艺请参考封装的热循环与回流温度规范，避免过热导致封装或芯片应力。
五、可靠性与选型建议
- 若系统对正向压降和效率要求更高，可对比低 Vf 的高级肖特基型号；若系统对漏电流要求极低，应选择低 IR 等级器件或选择其他封装/工艺。
- 在选型时同时考虑连续电流、浪涌能力与可用散热空间，确保长期热平衡。
- 推荐在样机阶段进行热仿真与实测，验证在目标工况下的结温与功耗分布，确保器件工作在安全范围内。
DSS16 以其 SOD-123FL 小型化、1A/60V 的基础电气性能，适用于多数中低功率整流与保护场合，是空间受限、需要表贴自动化生产的常用选择。
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