Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN SS310SMA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SS310SMA
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SS310SMA
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.543g
- Electronic Component
- 1
- Electronic Component
- BM0226525748
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 500uA@100V
- (Vf)
- 850mV@3A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS310SMA 产品概述
1. 产品简介
SS310SMA 是一款由伯恩半导体（BORN Semiconductor）生产的高性能肖特基二极管。该产品采用 SMA 封装，具有低正向压降和高反向耐压的特点，广泛应用于各种电源管理、整流和反向保护电路中。其优异的电气性能和可靠的封装设计使其成为工业和消费电子领域的理想选择。
2. 主要特性
- 整流电流（If）：3A
- SS310SMA 能够持续承受高达 3A 的整流电流，适用于中等功率应用。
- 正向压降（Vf）：850mV @ 3A
- 低正向压降意味着在导通状态下，二极管消耗的功率较低，有助于提高整体系统的能效。
- 直流反向耐压（Vr）：100V
- 高反向耐压确保了二极管在反向偏置时能够有效阻断电流，提供可靠的保护。
- 封装形式：SMA
- SMA 封装具有体积小、散热性能好的特点，适合高密度 PCB 布局。
3. 应用领域
SS310SMA 广泛应用于以下领域：
- 电源管理：用于开关电源、DC-DC 转换器等，提供高效的整流和反向保护。
- 消费电子：如手机充电器、笔记本电脑适配器等，确保电源的稳定性和可靠性。
- 工业控制：在电机驱动、自动化设备中，用于整流和反向电压保护。
- 汽车电子：在车载电源系统中，提供高效的整流和反向保护，确保系统的稳定运行。
4. 技术优势
- 低功耗：由于正向压降低，SS310SMA 在导通状态下消耗的功率较少，有助于提高系统的整体能效。
- 高可靠性：采用高质量的半导体材料和先进的制造工艺，确保产品在各种恶劣环境下都能稳定工作。
- 紧凑设计：SMA 封装体积小，适合高密度 PCB 布局，有助于减小设备的整体尺寸。
5. 性能参数
| 参数名称 | 参数值 |
|---|---|
| 整流电流（If） | 3A |
| 正向压降（Vf） | 850mV @ 3A |
| 直流反向耐压（Vr） | 100V |
| 封装形式 | SMA |
| 品牌 | BORN（伯恩半导体） |
6. 使用注意事项
- 温度范围：确保工作温度在规定的范围内，避免因过热导致性能下降或损坏。
- 焊接条件：遵循推荐的焊接温度和时间，避免因过热损坏二极管。
- 反向电压：避免超过规定的直流反向耐压，以防止二极管击穿。
7. 结论
SS310SMA 是一款高性能的肖特基二极管，具有低正向压降、高反向耐压和紧凑的封装设计。其优异的电气性能和广泛的应用领域使其成为电源管理、消费电子、工业控制和汽车电子等领域的理想选择。伯恩半导体的高质量制造工艺确保了产品的可靠性和稳定性，能够满足各种严苛的应用需求。
通过以上概述，可以看出 SS310SMA 在电子设计中的重要性和广泛应用前景。无论是提高系统能效，还是确保设备的稳定运行，SS310SMA 都能提供卓越的性能和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
