WMSIC Electronic Components

BORN BDFN2C241V35

ModelBDFN2C241V35
PackageDFN1006
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BDFN2C241V35
Type
BORN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BDFN2C241V35
Electronic Component
1
Package
DFN1006
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.033g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
20pF
Electronic Component
BM0263572171
Voltage
44V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BDFN2C241V35 瞬态抑制二极管(TVS)产品概述

一、产品定位与核心价值

BDFN2C241V35是伯恩半导体(BORN)推出的双向瞬态抑制二极管(TVS),专为低电压电路的过压防护设计,核心价值在于:以超小DFN1006封装实现双向过压防护,兼顾低结电容与高脉冲耐受能力,满足消费电子、通信、工业控制等领域对空间紧凑、高可靠性EMC防护的需求。

二、关键电气参数详解

该产品参数精准匹配低电压系统防护要求,核心参数及意义如下:

2.1 电压防护核心参数

  • 反向截止电压(Vrwm):24V:常态下TVS不导通的最大电压,适配工作电压≤24V的电路(如12V/24V电源、5V/3.3V信号接口),不影响电路正常运行;
  • 击穿电压(Vbr):26.7V:过压触发的典型电压,介于Vrwm与钳位电压之间,保证防护响应及时性;
  • 钳位电压(Vc):44V:过压脉冲峰值时的最大钳位电压,有效保护后级敏感元器件(如MCU、传感器,通常耐压≤30-40V)。

2.2 脉冲耐受能力

  • 峰值脉冲电流(Ipp):5A@8/20μs:承受行业标准浪涌波形的典型电流,可应对电源/信号端中等强度浪涌(如雷击感应、开关浪涌);
  • 峰值脉冲功率(Ppp):280W@8/20μs:对应5A脉冲的功率耐受值,验证浪涌防护可靠性。

2.3 其他关键参数

  • 反向漏电流(Ir):100nA:常态漏电流极低,对电路功耗影响可忽略;
  • 结电容(Cj):20pF:低结电容设计,减少对高频信号(如蓝牙、WiFi)的干扰,保障信号完整性;
  • 通道数:单路:单通道设计,适合单条线路的针对性防护(如USB数据线、传感器信号线)。

三、封装与可靠性设计

3.1 超小DFN1006封装

采用DFN1006封装(尺寸约1.0mm×0.6mm×0.4mm),体积仅为传统SOT-23封装的1/3,大幅节省PCB空间,适配智能手表、蓝牙耳机等便携式设备及小型通信模块。

3.2 符合国际EMC标准

产品通过IEC 61000-4系列核心标准测试:

  • IEC 61000-4-2(静电放电):应对人体/设备静电(接触放电±8kV、空气放电±15kV);
  • IEC 61000-4-4(电快速瞬变脉冲群):抑制开关浪涌、电机干扰等快速脉冲;
  • IEC 61000-4-5(浪涌):承受电源/信号端雷击感应浪涌(如±2kV接触放电、±4kV空气放电)。

四、典型应用场景

BDFN2C241V35的参数特性使其适用于多类低电压防护场景:

  1. 消费电子接口:智能手机USB充电口、音频接口,智能穿戴设备数据接口;
  2. 通信模块:蓝牙、WiFi、LoRa模块的信号输入/输出端,防止静电损坏射频芯片;
  3. 工业控制电路:PLC的12V/24V传感器接口、小型执行器控制线路;
  4. 汽车电子辅助电路:车载USB充电口、胎压监测传感器接口(低电压系统)。

五、选型与应用注意事项

  1. 参数匹配:系统工作电压需≤Vrwm(24V),避免TVS常态导通;
  2. 安装位置:靠近被保护元器件/接口,减少引线电感(降低钳位效果);
  3. 高频适配:20pF结电容适合100MHz以上高频信号,超高频场景需结合频率评估;
  4. 脉冲次数:避免长期重复超过额定Ipp的脉冲,防止器件老化。

BDFN2C241V35以高性价比实现多场景低电压过压防护,是消费电子、通信等领域小型化设计的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.