WMSIC Electronic Components

BORN BSD5A051V

ModelBSD5A051V
PackageSOD-523
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BSD5A051V
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BSD5A051V
Electronic Component
1
Package
SOD-523
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.016g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
30pF
Electronic Component
BM0263572174
Operating Temperature
55℃~+125℃
Voltage
12V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSD5A051V 产品概述

一、产品简介

BSD5A051V 是伯恩半导体(BORN)推出的一款单路单向 TVS 二极管,专为 5V 等普通信号线路提供静电与浪涌保护而设计。器件采用超小型 SOD-523(又称 SOT-523)封装,工作温度范围宽(-55 ℃ ~ +125 ℃),具有低反向泄漏、快速响应和高峰值冲击能力,适合用于接口保护、板级防护和一般电子终端设备。

主要典型参数:

  • 反向截止电压 Vrwm:5 V(稳态工作电压)
  • 击穿电压 VBR(I测试):约 6 V
  • 钳位电压 Vc(峰值):12 V(8/20 μs 浪涌)
  • 峰值脉冲电流 Ipp:8 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:100 W @ 8/20 μs
  • 反向电流 Ir:1 μA(在 Vrwm 条件下)
  • 结电容 Cj:典型 30 pF(描述中有 80 pF 的表述,请在设计时以实际出货规格为准)
  • 通道数:单路(单向)
  • 防护标准:满足 IEC 61000-4-2 / IEC 61000-4-4 / IEC 61000-4-5 要求
  • 封装:SOD-523(SOT-523)

二、主要特性与优势

  1. 小封装、低占板面积:SOD-523 超小封装便于在空间受限的 PCB 上部署,适合便携式、消费类和 IoT 终端产品。
  2. 高效浪涌吸收:在 8/20 μs 波形下有 8 A 的峰值脉冲承受能力与 100 W 的峰值功率,能够吸收常见浪涌事件,保护下游电路免受瞬态过压冲击。
  3. 低泄漏电流:反向漏电仅 1 μA,适用于对静态电流敏感的应用场景。
  4. 快速响应:TVS 器件对 ESD、浪涌响应迅速,能在纳秒级抑制瞬态电压尖峰。
  5. 符合电磁兼容标准:通过 IEC 61000-4-2 / 4-4 / 4-5 等测试,适用于对抗静电放电、传导/感应干扰和雷击类浪涌的场景。

三、典型应用场景

  • 5V 数字信号接口保护:GPIO、UART、I2C(注意 I2C 对容性敏感,需确认 Cj 值)
  • 5V 电源线与接口防护:如 USB(低速/全速场合需评估结电容对信号的影响)
  • 通用通信接口、防雷、防雷击浪涌的板级保护
  • 工业控制终端、消费电子、可穿戴设备与便携式设备的输入端口保护

注意:若用于高速差分接口(如 USB 2.0 高速/USB 3.0/高速以太网),结电容对信号完整性影响较大,请优先选用低 Cj 专用型号并在设计前确认出货说明书的结电容值。

四、典型电路与布局建议

  • 放置位置:TVS 应尽量靠近受保护的接口或连接器布置,缩短信号线至 TVS 的长度,以减少串联电感与抑制回路。
  • 地线处理:将 TVS 的地端接入低阻抗的参考地或地平面,采用单点或短路径接地,避免通过长走线回流导致钳位效率下降。
  • 旁路与滤波:若电路中存在滤波器或差分对,确保 TVS 与滤波元件的配置不会引发阻抗不匹配或反射。
  • 焊盘设计:按厂商推荐的焊盘尺寸设计,保证焊接可靠性与热量分散。
  • 多通道保护:若系统中有多个信号线需保护,避免将多个 TVS 的潮水式接地回路并联在一小段地线上,尽量分散接地点或使用共地平面。

五、可靠性与使用注意事项

  • 温度:器件工作温度范围宽,适合工业级应用,但在高温长时间工作时要关注热耗散与 PCB 的散热能力。
  • 极性:BSD5A051V 为单向 TVS,安装时注意极性方向(标识阳极/阴极),错误安装将导致失效或无法实现预期保护。
  • 结电容差异:封装小尺寸下不同批次或不同子型号结电容可能有所差异,涉及高速信号时务必索取并确认 ICC/规格书中的典型与最大 Cj。
  • 标准合规性:器件符合常见静电与浪涌试验标准,但系统级 EMC 设计还需结合 PCB、接口布局和外壳接地等整体方案验证。

六、结语

BSD5A051V(BORN)以其小巧封装、可靠的瞬态吸收能力和对 5V 类信号线的良好匹配,适合作为板级和接口级的通用防护元件。选择和布局时请综合考虑结电容对信号完整性的影响,并参照厂商完整规格书与实际器件参数进行最终设计与验证。如需在高速差分或对容性极为敏感的线路使用,建议向供应商确认具体 Cj 值或选择专用低容抗 ESD 器件。

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