WMSIC Electronic Components

BORN BZT52C6V8S

ModelBZT52C6V8S
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BZT52C6V8S
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BZT52C6V8S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
15Ω
Electronic Component
BM0228551981
Diode
1
Current(Ir)
2uA@4V
Power Dissipation(Pd)
200mW
Electronic Component
6.4V~7.2V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C6V8S 产品概述

一、主要性能与参数

BZT52C6V8S 是 BORN(伯恩半导体)生产的独立式稳压二极管,标称稳压值为 6.8V,允许范围为 6.4V ~ 7.2V。主要电气参数包括:反向漏电流 Ir = 2µA(在 Vr = 4V 时测得),耗散功率 Pd = 200mW,两个不同工况下的阻抗值为 Zzk = 80Ω 与 Zzt = 15Ω(均按厂方规定测试条件测出)。该器件适合用作低功耗电压基准、过压钳位与小信号偏置场合。

二、封装与机械特性

器件采用 SOD-323 小型表贴封装,体积小、焊接方便,适用于空间受限的便携式与消费类电子产品。作为小功率封装,热阻相对较高,实际最大耗散能力受 PCB 散热条件影响,应按 Pd 200mW 的额定值并考虑降额使用。

三、典型应用场景

  • 电源参考与基准电压源(低电流场合)
  • 输入过压、浪涌钳位保护(与限流电阻配合)
  • 模拟电路偏置稳定、放大器参考节点
  • 便携式设备与物联网终端的低功耗稳压需求

四、设计注意事项与使用建议

  • 功率与压降:在设计时需保证在工作点上耗散功率不超过 200mW,并考虑环境温度与 PCB 散热。建议在靠近稳压二极管的铜箔上适当增加散热面积以改善热性能。
  • 串联电阻:通常与串联电阻配合使用以限制电流,计算时应按最坏情况(最高环境温度、最大输入电压)核算功耗。
  • 阻抗与稳压精度:阻抗值会影响在不同电流下的稳压精度,设计中应参考器件在指定测试电流下的阻抗特性以评估动态响应。
  • 漏电流影响:Ir = 2µA 表明在低电压偏置时漏电小,适合低功耗应用,但在超低电流精密电路中仍需注意漏电累积影响。
  • 焊接:建议遵循厂商回流焊温度曲线及湿敏等级说明,避免过高峰值温度及长时间高温暴露。

五、可靠性与储存建议

建议按厂家推荐的包装与干燥条件储存,避免长时间潮湿环境;装配时注意静电防护与正确极性。对于长期可靠性要求高的应用,应进行温度循环与寿命评估,确认在目标工况下稳定性满足设计要求。

总结:BZT52C6V8S 以其小体积、6.8V 稳压点和低漏电特性,适合多种低功耗、空间受限的电子应用。产品选型与电路设计时应重点考虑功耗、散热与阻抗对稳压精度的影响。

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