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BORN 1SMB5921B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN 1SMB5921B
- Type
- BORN
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- 1SMB5921B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.181g
- Electronic Component
- 1
- (Zzk)
- 200Ω
- (Zzt)
- 2.5Ω
- Electronic Component
- BM0231019425
- Diode
- 1
- Current(Ir)
- 5uA
- Power Dissipation(Pd)
- 3W
- Electronic Component
- 6.46V~7.14V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMB5921B 产品概述
一、概述与主要参数
1SMB5921B 是伯恩半导体（BORN）提供的一款稳压二极管类器件（未分类），采用 SMB (DO-214AA) 表面贴装封装。其稳压值范围为 6.46V ~ 7.14V，可作为低功率直流稳压与过压钳位元件使用。主要电气参数包括：工作结温范围 -55℃ ~ +150℃；耗散功率 Pd=3W（在规定的散热条件下）；反向电流 Ir=5μA（在额定反向电压条件下）；两项阻抗指标为 Zzk=200Ω 与 Zzt=2.5Ω，分别反映在不同测试条件下的动态阻抗特性。
二、封装与热特性
器件采用 SMB (DO-214AA) 表面贴装封装，适合中等功耗应用的自动贴装与回流焊工艺。3W 的功耗额定值要求在电路板设计时做好散热管理：推荐在焊盘下方和周围布局铜箔散热区域和过孔以增强热传导，并参考厂商提供的 Pd 对环境温度的降额曲线在高温工况下进行功率限制。长时间工作时需关注结温，确保不超过 +150℃ 的上限。
三、典型应用场景
- 作为基准/稳压元件，为小功率模拟电路、参考源或基线稳压提供稳定电压。
- 作为瞬态或过压保护元件，对敏感输入端进行钳位，保护后级器件免受瞬态升压损害。
- 在功率受限的供电模块、传感器前端、通信设备的保护与稳压电路中应用。
四、设计与使用注意事项
- 稳压测量应在规范的测试电流条件下进行，稳压值区间 6.46V~7.14V 表示典型偏差范围，实际电路中需考虑温度漂移与电流变化带来的影响。
- Zzk（200Ω）与 Zzt（2.5Ω）分别代表在不同测试点的动态阻抗，前者通常对应小电流或转折区阻抗，后者对应标称测试电流下的稳态阻抗。较低的 Zzt 有利于输出电压在负载或电流波动时保持稳定。
- 反向漏电 Ir=5μA 在某些高阻输入或低功耗场合可能影响精度，应在选型时评估漏电对系统的影响。
- 在 PCB 布局上应为 SMB 封装提供足够的焊盘面积与铜厚，必要时使用多个过孔将热量传导至板底或内层散热层。
五、测试与可靠性验证
- 建议进行稳压特性测试（Vz–Iz 曲线）、动态阻抗测量、漏电流随温度变化测试以及在最大允许功耗下的热稳定性测试。
- 做热循环与焊接可靠性试验以验证封装和焊点在回流焊工艺后的可靠性。长期工作需关注结温累积效应并按厂商指南进行降额处理。
六、选型与替代建议
在选型时权衡稳压精度、动态阻抗、最大耗散功率与封装散热能力。若系统对漏电或温漂有更高要求，可选择漏电更低或温漂更小的同类稳压器件；若需要更高能量吸收能力，则考虑功率更高或封装更大（如 SMB、SMA 以外）的保护元件。最终请以制造商完整数据手册为准，并在实际电路环境中做验证。
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