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BORN S3MSMC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN S3MSMC
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- S3MSMC
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.351g
- Electronic Component
- 1
- Electronic Component
- BM0264682162
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 10uA@1kV
- (Vf)
- 1.15V@3A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 1kV
- Surge Current (Ifsm)
- 100A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S3MSMC 产品概述
一、产品简介
S3MSMC 是 BORN（伯恩半导体）推出的一款通用高压整流二极管，单颗独立封装，适用于中高压直流整流与保护场合。器件采用 SMC (DO-214AB) 表面贴装封装，结构稳健、可靠性高，设计用于工业级工作环境。
二、主要特性
- 正向压降低：Vf = 1.15V @ IF = 3A，降低导通损耗。
- 高耐压：直流反向耐压 VR = 1kV，可承受高压整流要求。
- 低反向泄漏：Ir = 10μA @ 1kV，在高压下仍保持较低漏电。
- 强抗浪涌能力：非重复峰值浪涌电流 Ifsm = 100A，适应启动和冲击电流。
- 工作结温宽：-65℃ ～ +150℃，适用于严苛温度环境。
三、关键电气参数
- 整流电流（平均）：3A。
- 正向压降：1.15V @ 3A（用于功率损耗估算 P≈1.15×I）。
- 反向电流：10μA @ 1kV（高压条件下泄漏小）。
- 峰值浪涌：100A（单次非重复脉冲）。
- 工作结温：-65℃ 至 +150℃。
四、典型应用
- 开关电源（SMPS）与整流桥电路
- 逆变器、变频器中的高压整流与钳位
- 电池充电器、UPS 与太阳能系统
- 工业电源、HVDC 辅助电路、浪涌抑制与续流回路
五、封装与热管理
SMC (DO-214AB) 封装利于焊接与散热，推荐在 PCB 上采用较大铜箔散热区并结合过孔下通至散热层，长期满载时需考虑导通损耗产生的热量并适当降额使用。
六、使用注意与选型建议
- 在高温或高正向电流条件下注意热沉与散热设计；按应用环境对整流电流做温度降额。
- 高频反向恢复特性未列出时，请在高频开关应用中评估开关损耗与 EMI。
- 对漏电敏感的高压场合，建议在实际温度下验证 Ir 值变化。
七、包装与订购信息
品牌：BORN（伯恩半导体）；型号标识：S3MSMC；封装：SMC (DO-214AB)。如需样品、批量报价或产品资料（SPICE 模型、可靠性报告、焊接规范），请联系供应商或厂家技术支持获取详细文件。
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