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BORN 1SMB5930B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN 1SMB5930B
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- 1SMB5930B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.18g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 10Ω
- Electronic Component
- BM0264897301
- Diode
- 1
- Current(Ir)
- 1uA
- Power Dissipation(Pd)
- 3W
- Electronic Component
- 15.2V~16.8V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMB5930B 产品概述
一、产品简介
1SMB5930B 是由 BORN（伯恩半导体）推出的一款独立式贴片稳压管，采用 SMB（DO-214AA）封装，额定耗散功率为 3W。该器件为高可靠性、低漏电的表贴稳压二极管，稳压值范围在 15.2V ～ 16.8V，适用于需要中等功率稳压、基准或电压钳位的应用场景。
二、主要参数与特点
- 稳压形式：单个独立式稳压二极管（Zener）
- 稳压值范围：15.2V ～ 16.8V（提供公差良好的稳压性能）
- 反向电流 Ir：典型 1 μA（低漏电，适合高阻抗电路）
- 耗散功率 Pd：3 W（良好散热条件下工作）
- 结温工作范围：-55 ℃ ～ +150 ℃（宽温度工作能力）
- 交流阻抗 Zzt：10 Ω（在规定测试点的稳压动态阻抗）
- 直流阻抗 Zzk：600 Ω（低频或直流下的等效阻抗）
- 封装：SMB（DO-214AA）表面贴装，适用于自动化生产与回流焊工艺
三、应用场景
1SMB5930B 适用于多种需要稳压或电压钳位的场合，包括但不限于：
- 电源辅稳压/基准源
- 过压保护与瞬态抑制（配合限流元件）
- 仪器仪表的参考电压模块
- 工业控制、通信设备及汽车电子（在符合温度和散热条件下）
四、设计与热管理建议
- 为保证 3W 的额定耗散能力，须提供良好散热路径：在 PCB 布局中为器件端接铜箔扩大散热区或增加散热金属层。
- 推荐在靠近器件的 PCB 区域添加热过孔或散热垫，以降低结温上升并延长寿命。
- 长时间工作时应考虑功率降额；在高环境温度下请参考厂家的功率-温度降额曲线以确定允许耗散。
五、封装与焊接
SMB（DO-214AA）为表贴封装，适用于回流焊工艺。焊接时请遵循厂家推荐的回流曲线，避免超过器件允许的焊接峰值温度及时长；焊后应避免机械冲击与热循环应力过大。
六、可靠性与存储
器件设计用于宽温范围工作，符合工业级可靠性要求。存储时应保持干燥、避免潮气与强腐蚀性气体，长期存放建议按行业常规进行烘干与防潮处理，防止回流焊接时出现焊接缺陷。
七、选型与采购提示
在选型时，请确认稳压值与电路工作点（最大稳压电流、散热条件）匹配；若需更精确参数（如测试电流 Izt、典型伏安曲线和降额曲线），建议参考 BORN 官方数据手册或向供应商索取完整规格表与曲线图，以保证在目标应用中的可靠性与性能稳定。
如需封装尺寸图、典型伏安特性曲线或应用电路示例，我可进一步提供详细资料。
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