Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN BZT52C8V2S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BZT52C8V2S
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- BZT52C8V2S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.028g
- Electronic Component
- 1
- (Zzk)
- 80Ω
- (Zzt)
- 15Ω
- Electronic Component
- BM0231019381
- Diode
- 1
- Current(Ir)
- 700nA@5V
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 7.7V~8.7V
- Electronic Component
- 3000
- Electronic Component
- 8.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C8V2S 产品概述
一、概述
BZT52C8V2S 为 BORN（伯恩半导体）生产的独立式稳压二极管，标称稳压值 8.2V，工作范围 7.7V～8.7V，封装为小巧的 SOD-323。器件针对小功耗、空间受限的消费电子与通信终端应用，提供稳健的电压钳位与低漏电特性。
二、主要电气参数
- 稳压值（标称）：8.2V；稳压范围：7.7V～8.7V
- 反向漏电流 Ir：700nA（在 5V 测试条件下）
- 最大耗散功率 Pd：200mW（环境 25°C 时）
- 动态阻抗 Zzt：15Ω；静态阻抗 Zzk：80Ω
这些参数表明器件在低电流工作点具有较低的泄漏和中等阻抗，适合做电压参考/钳位与低功耗保护。
三、封装与机械特性
SOD-323 小型封装，适合自动贴装（SMT），占板面积小，便于在密集布线板上使用。封装极性可通过器件表面标记（负极带）识别，安装时注意极性。
四、应用场景
- 低功耗电源参考与稳压
- 信号线过压保护与钳位
- 小型消费电子、便携式设备、传感器模块与通信前端
五、设计与使用建议
- 耗散功率需按环境温升降额：在高温或散热差场合应减小稳压电流或增加散热措施。
- 动态阻抗较高时，负载电流变化会引起稳压点漂移，设计时预留容差。
- 在高精度参考场合建议并联滤波或使用更低阻抗器件。
- 储存与回流焊按厂家推荐温度曲线执行，避免超温损伤。
六、采购与替代
BZT52C8V2S 适用于需要小封装、低功耗稳压的场合。如需更低阻抗或更高功率，应选用更大功耗或低阻抗系列产品，并注意参数匹配。购买时请确认封装（SOD-323）、标称电压与批次检验报告。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
