Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS1060 为一颗独立式整流二极管,设计用于中等功率整流与保护电路。器件由 BORN(伯恩半导体)生产,适合在要求高整流电流与耐压的电源及功率管理场景中使用。
外壳符合 JEDEC DO-214AB 标准,封装形式为 SMC(模压塑料)。引脚为轴向引线,可按 MIL-STD-750 方法 2026 进行可焊性处理。极性以色带标示阴极,安装姿态不限,便于设计布局。
器件允许高达 +175 ℃ 的结温,适应高温工况,但长期可靠性建议按厂方资料进行结温限制和散热设计。大电流工作时需配合足够的散热铜箔或散热板以降低结-环境温升。浪涌电流 120 A 仅适用于非重复瞬态,避免重复超过此值。
焊接时遵循厂商与 MIL-STD-750 方法 2026 要求,避免超过最大结温并控制焊接热量集中。布板时为保证散热与电流承载,建议增加焊盘面积和底层铜厚,使用多层接地/散热层有助于降低结温。装配时注意色带方向以确保极性正确。
BORN(伯恩半导体)出品,封装为 SMC,型号为 SS1060。采购与设计前建议索取并核对完整 datasheet、样品和可靠性报告,以确认实际电气与热参数满足最终产品要求。
如需更详细的电气特性曲线、热阻和封装尺寸,请参阅厂方数据手册或联系供应商获取技术支持。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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