WMSIC Electronic Components

BORN SS1060

ModelSS1060
PackageSMC
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SS1060
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SS1060
Electronic Component
1
Package
SMC
Electronic Component
Schottky Diode
Electronic Component
0.375g
Electronic Component
1
Electronic Component
BM0264900542
Current
10A
Diode
1
Current(Ir)
100uA@60V
(Vf)
850mV@10A
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS1060 产品概述

一、产品简介

SS1060 为一颗独立式整流二极管,设计用于中等功率整流与保护电路。器件由 BORN(伯恩半导体)生产,适合在要求高整流电流与耐压的电源及功率管理场景中使用。

二、主要技术参数

  • 正向压降 (Vf):0.85 V @ 10 A(典型)
  • 直流反向耐压 (Vr):60 V
  • 连续整流电流:10 A
  • 非重复峰值浪涌电流 (Ifsm):120 A
  • 反向漏电流 (Ir):100 μA @ 60 V
  • 工作结温范围:-55 ℃ ~ +175 ℃

三、封装与机械特性

外壳符合 JEDEC DO-214AB 标准,封装形式为 SMC(模压塑料)。引脚为轴向引线,可按 MIL-STD-750 方法 2026 进行可焊性处理。极性以色带标示阴极,安装姿态不限,便于设计布局。

四、热性能与可靠性注意

器件允许高达 +175 ℃ 的结温,适应高温工况,但长期可靠性建议按厂方资料进行结温限制和散热设计。大电流工作时需配合足够的散热铜箔或散热板以降低结-环境温升。浪涌电流 120 A 仅适用于非重复瞬态,避免重复超过此值。

五、典型应用场景

  • 开关电源整流与二次侧保护
  • 充电器与适配器整流链路
  • 串联/并联功率整流模块
  • 反向极性保护与自由轮回路
  • 馈线与电机驱动保护电路

六、使用与焊接建议

焊接时遵循厂商与 MIL-STD-750 方法 2026 要求,避免超过最大结温并控制焊接热量集中。布板时为保证散热与电流承载,建议增加焊盘面积和底层铜厚,使用多层接地/散热层有助于降低结温。装配时注意色带方向以确保极性正确。

七、品质与采购

BORN(伯恩半导体)出品,封装为 SMC,型号为 SS1060。采购与设计前建议索取并核对完整 datasheet、样品和可靠性报告,以确认实际电气与热参数满足最终产品要求。

如需更详细的电气特性曲线、热阻和封装尺寸,请参阅厂方数据手册或联系供应商获取技术支持。

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