WMSIC Electronic Components

BOURNS SDR0403-2R2ML

ModelSDR0403-2R2ML
PackageSMD
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SDR0403-2R2ML
Type
BOURNS
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SDR0403-2R2ML
Electronic Component
1
Package
SMD
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.336g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0209751898
Current
2.6A
Resistor(DCR)
47mΩ
Electronic Component
Electronic Component
Electronic Component
2000
and Current(Isat)
3.9A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDR0403-2R2ML(BOURNS)产品概述

SDR0403-2R2ML 是 BOURNS 提供的一款 SMD 功率电感,面向开关电源与电源滤波应用。器件体积紧凑(约 4.0 × 4.5 mm),具有较高的额定电流与良好的直流电阻特性,适合在空间受限但对纹波电流与损耗有一定要求的电源模块中使用。

一、主要参数(关键规格)

  • 型号:SDR0403-2R2ML
  • 品牌:BOURNS
  • 电感值:2.2 μH(公差 ±20%)
  • 额定电流(Irated):2.6 A(热限流,长期允许通过的电流)
  • 饱和电流(Isat):3.9 A(电感值下降到额定值的某一比例时对应的电流)
  • 直流电阻(DCR):约 47 mΩ
  • 封装形式:SMD,尺寸约 4.0 × 4.5 mm(适用于自动贴装与回流焊接)
    这些参数决定了器件在开关电源中承受纹波与直流分量时的电性能与功率损耗。

二、性能与工作特性说明

  • 电感与公差:2.2 μH ±20% 适用于需要中等量级储能与滤波的升降压和降压转换器,允许在元件选择时保留一定余量以适应工艺和温漂。
  • 饱和行为:Isat = 3.9 A 表明在短时高电流冲击或过载情况下电感将进入饱和区,电感值显著下降,应避免长期运行接近或超过此值,以免引起电路失稳或过大涟波电流。
  • 热限流与损耗:额定电流 2.6 A 是在允许温升条件下的长期电流值,结合 DCR = 47 mΩ,可估算铜损为 I^2·R。在设计中应以额定电流为依据进行热容与散热规划,必要时考虑并联或适当降额使用。
  • 高频特性:SMD 功率电感通常在开关频率范围内呈现一定频率依赖性(包括磁芯损耗与绕组寄生电容影响),在高频应用中建议在目标频段进行实际测量或与厂家数据对比验证。

三、典型应用场景

  • 开关电源(DC-DC)中的输出滤波或储能电感(降压、升压或同步整流场合)。
  • 电源管理模块(PMIC)与点对点电源系统。
  • 电池供电设备的电源转换与滤波。
  • 工业控制、通信与消费电子中对中等电流、高可靠性电源路径的应用。

四、布局与安装建议

  • 将电感尽量靠近开关器件或负载,减小回路面积,降低电磁干扰(EMI)。
  • 引脚与焊盘应保证足够的铜厚与焊盘面积,以降低接触电阻并帮助散热;必要时在底层添加多通孔(vias)连接大面积接地/散热层。
  • 避免将敏感信号线与开关结点并行布线,减小耦合噪声。
  • 回流焊工艺应遵循器件及PCB的耐温要求:常规 SMD 回流曲线、控制峰值温度和升温速率,避免过热导致磁芯性能退化或外观损伤。

五、选型与可靠性考虑

  • 电流裕度:设计中建议以额定电流为长期工作基准,并留有至少 20–30% 的裕量以应对瞬态纹波与环境温度升高导致的降额。
  • 饱和裕度:若电路存在较大的峰值电流(如启动冲击或短路情形),应确保峰值远低于 Isat,或选择饱和电流更高的型号。
  • 损耗与效率:DCR 直接影响铜损,若系统对效率要求高,可考虑更低 DCR 的电感或在方案中增加散热措施。
  • 可靠性测试:在关键应用中建议进行温升、振动、热循环等可靠性验证,确保长期稳定性。

六、替代与扩展建议

  • 若需要更低的直流损耗,可选用同系列更大截面绕组或低 DCR 型号;若需要更高的饱和电流,应选取具有更高 Isat 的产品或并联电感(需注意公差与相序影响)。
  • 在对 EMI 有严格限制的场合,可配合输入/输出滤波网络与布局优化来满足规范。

总结:SDR0403-2R2ML 以紧凑封装、2.2 μH 的电感值与较高的额定/饱和电流(2.6 A / 3.9 A)为特征,适合中等功率的开关电源与电源滤波应用。选型时应综合考虑 DCR 损耗、热管理和电流裕度,并在目标频段做电磁与温升验证以确保系统性能与可靠性。

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