WMSIC Electronic Components

BOURNS TC33X-2-504E

ModelTC33X-2-504E
PackageSMD-3P,3.8x3.6mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS TC33X-2-504E
Type
BOURNS
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
1
Electronic Component
TC33X-2-504E
Electronic Component
1
Package
SMD-3P,3.8x3.6mm
Electronic Component
Resistor / positions
Electronic Component
±25%
Electronic Component
0.056g
Electronic Component
500kΩ
Electronic Component
1
Electronic Component
BM0257254039
Electronic Component
±250ppm/℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC33X-2-504E 产品概述

一、概述

TC33X-2-504E 是 BOURNS 推出的微型表面贴装可调电阻(电位器),阻值 500kΩ,单圈设计,适用于对体积和高度有严格限制的电子设备中执行微调和校准任务。器件小巧(封装 SMD-3P,尺寸约 3.8 × 3.6 mm),便于高速贴装与批量生产。

二、主要电气参数

  • 阻值:500 kΩ
  • 精度(初始容差):±25%
  • 功率额定值:100 mW(请按环境温度与散热条件作相应降额)
  • 温度系数:±250 ppm/℃
  • 圈数:1(单圈)

这些参数决定了 TC33X-2-504E 更适合信号级和低功率调节、偏置与校准用途,而非大功率负载场合。

三、机械与封装

  • 封装类型:SMD-3P,表面贴装三端结构
  • 尺寸:约 3.8 × 3.6 mm,适合紧凑 PCB 布局
  • 调整方式:微型调整机构(建议使用适配的微型一字/十字螺丝刀或专用调节工具)
    该器件便于自动贴片与回流焊流程(具体焊接工艺参数请参见厂商资料)。

四、典型应用

  • 模拟电路微调与偏置(放大器、比较器)
  • 传感器与测量电路的灵敏度/零点校准
  • 通信与便携终端中的信号调整
  • 低功率音频或控制信号微调
    由于功率和容差限制,不建议用于高精度或高功率电源调整场景。

五、使用与设计建议

  • 功率管理:100 mW 为额定消耗,实际电压/电流需按 P = V^2/R 或 I^2R 计算并考虑环境降额。
  • 温漂与精度:±250 ppm/℃ 与 ±25% 的组合表明长期与温度变化下为中等稳定性,若对精度或温度稳定性有更高要求,应考虑低温漂或更高精度型号。
  • 接线方式:可作三端电位器使用(形成电压分压器),或作为两端可变电阻(W 与一端短接)使用。
  • PCB 布局:为保证可靠焊接与调整空间,建议在 PCB 设计时预留合适的定位和调节孔/空位,并参照厂方推荐焊盘尺寸。

六、选型与替代

当需要更高精度、更低温漂或更大功率时,可选择 BOURNS 或其他厂商的高精度或多圈可调电阻替代。若需要更小阻值或不同圈数,可在同系列查找相近封装的不同阻值版本。

七、包装与订购建议

TC33X-2-504E 作为 SMD 元件,适合卷带供料,便于贴片线使用。采购时请关注生产批次和储存条件,必要时索取器件数据手册与回流焊曲线以确保装配与性能符合项目要求。

如需我提供典型电路接法图、PCB 焊盘建议尺寸或与常见替代型号的对比表,可告知用途与环境条件,我将给出更具体的建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.