WMSIC Electronic Components

BOURNS SRP7050TA-150M

ModelSRP7050TA-150M
PackageSMD,7.3x6.6mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRP7050TA-150M
Type
BOURNS
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRP7050TA-150M
Electronic Component
1
Package
SMD,7.3x6.6mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.6g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0256952458
Electronic Component
AEC-Q200
Current
3.5A
Resistor(DCR)
81mΩ
Electronic Component
Electronic Component
Electronic Component
800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRP7050TA-150M 产品概述

一、主要参数

  • 品牌:BOURNS
  • 型号:SRP7050TA-150M
  • 电感值:15 μH(±20%)
  • 额定直流电流(Irms/Rated):3.5 A
  • 饱和电流(Isat):6 A
  • 直流电阻(DCR):81 mΩ(0.081 Ω)
  • 封装:SMD,外形约 7.3 × 6.6 mm
  • 车规等级:AEC‑Q200

二、关键特性

SRP7050TA-150M 属于功率电感系列,针对开关电源与电源滤波场景设计。15 μH 的电感量适合较低频率的滤波或较高占空比的降压应用。较高的 Isat(6 A)保证在瞬态或短时过流下电感不过早饱和;额定电流3.5 A 表示在连续工作时应考虑热和损耗限制。81 mΩ 的 DCR 提示在中等电流下会产生明显的铜损,设计时需关注效率与热耗散。

三、典型应用

  • 汽车电子 DC‑DC 降压模块(符合 AEC‑Q200 要求)
  • 工业与通信电源滤波与储能回路
  • 开关电源(同步/非同步降压转换器)中的储能元件
  • 输入侧或输出侧低频噪声抑制与纹波滤波

四、选型与使用建议

  • 电流与热管理:在额定电流 3.5 A 时,铜损 P = I^2·DCR ≈ 3.5^2×0.081 ≈ 0.99 W,建议在板上留有充分散热铜箔与过孔以降低结温;若期望更高效率或连续大电流,请考虑 DCR 更低或更大封装的器件。
  • 饱和裕量:为避免工作点接近饱和,连续应用时建议预留 20–40% 的裕量(即长期工作电流低于 Isat)。短时峰值可接近 Isat。
  • 纹波电流与磁损:高频开关时注意核心损耗,选择合适工作频率并参考厂商的磁性材料特性曲线(必要时向厂商索取详细 L‑ vs‑Id 曲线与损耗数据)。
  • 容差影响:±20% 容差在滤波与谐振回路中会影响截止频率,若需严格频率响应请选用容差更严格的型号或通过电路调整补偿。

五、封装与可靠性

7.3×6.6 mm 的 SMD 封装适合自动贴装与回流焊;BOURNS 提供 AEC‑Q200 认证,满足汽车级可靠性与环境应力试验要求,适用于车载与高可靠性工业场景。装配时遵循厂商回流焊温度曲线,避免过度热循环影响磁性能。

六、PCB 布局与散热建议

  • 将电感靠近开关管或稳压器的高电流回路处布置,缩短信号回路长度以降低 EMI。
  • 底面放置宽铜箔并通过多个过孔连接到内部或底层散热平方,以提升热扩散能力。
  • 输入和输出旁的去耦电容应尽量靠近电感与器件引脚,减少环路面积。
  • 如需要进一步降低温升,可在电感周边保留间隙避免热聚集,并考虑强制风冷或更高散热能力的布局。

小结:SRP7050TA-150M 提供汽车级可靠性的功率电感解决方案,适用于需要 15 μH 量级且偶发大电流(最高接近 6 A)工作场景。选型时应兼顾 DCR 导致的功耗与热管理,合理布板与留有饱和裕量可确保长期稳定运行。

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