WMSIC Electronic Components

BHFUSE BSMD2410C-2200T BSMD2410C

ModelBSMD2410C-2200T
Package2410
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2410C-2200T
Type
2410
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2410C-2200T
Electronic Component
1
Electronic Component
2.6mm
Package
2410
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.197g
Electronic Component
6.1mm
Electronic Component
2.6mm
I2t
760
Electronic Component
1
Electronic Component
100A@350VAC
Electronic Component
BM0257686112
Operating Temperature
55℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2410C-2200T 产品概述

一、产品简介

BSMD2410C-2200T 为佰宏(BHFUSE)出品的贴片式保险丝,封装规格为 2410(尺寸 6.1 × 2.6 × 2.6 mm)。该器件针对高电流、小体积的电路保护需求设计,额定电流 20A、额定电压 350V,适用于多种电源与功率电子应用的过流与短路保护。

二、主要性能参数

  • 类型:贴片式保险丝(SMD)
  • 额定电流:20A
  • 额定电压:350V
  • 工作温度范围:-55℃ 至 +125℃
  • 熔断 I2t:760 A²s
  • 分断能力:100A @ 350VAC
  • 尺寸(长 × 宽 × 高):6.1 mm × 2.6 mm × 2.6 mm
  • 封装:2410(SMD)

三、产品特点

  1. 小体积高电流:2410 封装兼顾板上空间与大电流承载能力,适合高密度电源模块。
  2. 高分断能力:100A@350VAC 的分断能力可应对突发短路,增强系统可靠性。
  3. 宽工作温度:-55℃~+125℃,适合工业级环境与温度变化大的应用场景。
  4. 明确的能量特性(I2t=760 A²s),便于与上游保护元件(如保险丝、断路器、抑制器)配合设计系统级保护。

四、典型应用场景

  • 开关电源与逆变器输入保护
  • 充电设备与电池管理系统(外围保护)
  • 工业自动化电源模块与驱动器
  • LED 驱动、电力变换与UPS系统
  • 通信与基站电源保护

五、选型与使用建议

  1. 根据最大工作电流与启动冲击电流选择额定电流,考虑实际电路的峰值与持续热稳定条件;
  2. 利用产品的 I2t 指标评估与下游或上游器件(如半导体开关)的能量协调,避免过度应力;
  3. 考虑环境温度对额定电流的降额,必要时选用更高额定值或并联设计以延长寿命;
  4. 贴装兼容回流焊工艺,推荐在设计版图时保留足够焊盘面积与热扩散路径以保证散热。

六、包装与可靠性

2410 封装适合自动贴装与回流流程。长期可靠性与环境适应性表现在宽温度范围及较高的分断能力上。储存与加工时避免机械冲击与强腐蚀性环境,遵循常规元件防潮与焊接规范。

若需更详尽的电气时限曲线(熔断时间-电流曲线)、回流焊温度曲线或样品评估数据,请提供联系方式或索取技术资料,以便提供更精准的设计支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.