WMSIC Electronic Components

BELLING BL8071GCLATR33

ModelBL8071GCLATR33
PackageSOT-223
BrandBELLING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BELLING BL8071GCLATR33
Type
BELLING
Minimum package
2500 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
650mV@(1.5A)
Electronic Component
BELLING
Electronic Component
BL8071GCLATR33
Electronic Component
1
Package
SOT-223
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.29g
Electronic Component
1
Electronic Component
BM0228055575
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
3.3V
Output Current
1.5A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BL8071GCLATR33 — 3.3V 固定线性稳压器产品概述

一、产品简介

BL8071GCLATR33 是贝岭(BELLING)推出的一款固定输出型线性低压差稳压器(LDO),输出电压为 3.3V,单通道设计,封装为 SOT-223。器件面向对噪声、纹波抑制及低静态电流有要求的嵌入式与工业应用,可提供高达 1.5A 的输出电流,并内置过流保护与热关断功能,工作环境温度范围为 -40℃ 至 +85℃(Ta)。

二、主要性能与特点

  • 输出类型:固定(3.3V,正极输出)
  • 最大输出电流:1.5A
  • 压降(典型):650mV @ 1.5A(低压差特性)
  • 静态电流(Iq):约 150μA(待机耗电低)
  • PSRR:65dB @ 1kHz(良好电源纹波抑制)
  • 保护功能:过流保护(OCP)、热关断(OTP)
  • 工作温度:-40℃ ~ +85℃(Ta)
  • 封装:SOT-223,便于 PCB 散热处理与手工焊接

三、封装与引脚(SOT-223)

SOT-223 封装体积小、散热面较大,适合板上热量通过铜箔扩散处理。典型引脚排列为 IN、GND、OUT(具体引脚与封装图请参考厂商资料)。推荐在 PCB 设计时在引脚周围建立较大的散热铜箔区域并打通热 VIAs 以提升散热能力。

四、热设计与功耗估算

线性稳压器的功耗等于 (Vin - Vout) × Iout。例如在 Vin = 6V、Vout = 3.3V 且 Iout = 1.5A 时,耗散功率约为 4.05W。对 SOT-223 封装而言,这一功耗在无额外散热时会导致器件温升显著,因此在高电流工作条件下必须考虑:

  • 增大 PCB 散热铜箔并使用散热孔(Vias);
  • 若条件允许,降低输入电压或分流负载以减少耗散;
  • 必要时采用外部散热片或改用更大封装的稳压器。
    具体热阻(θJA/θJC)与允许结温请参阅完整数据手册并进行热仿真计算。

五、外部元件与布局建议

  • 输入端:在 IN 与 GND 之间靠近器件放置 0.1μF 陶瓷去耦电容,抑制高频噪声;若输入源阻抗较高,可并联 1μF~10μF 滤波电容。
  • 输出端:LDO 对输出电容稳定性敏感,推荐使用低 ESR 的陶瓷或钽电容(例如 10μF~22μF),并靠近 OUT 与 GND 引脚放置。具体容值与 ESR 要求请依据厂商数据手册确认。
  • 布局:信号与电源走线短且粗,GND 建议采用完整的地平面,避免环路面积。热散区域应与器件底部相连并加铺铜。

六、典型应用场景

  • 嵌入式单板与微控制器供电(从 5~7V 输入降至 3.3V)
  • 通信模块与射频前端(受益于较高 PSRR)
  • 工业控制与仪表(支持宽温度范围)
  • 消费电子与接口电源(需注意热管理)

七、选型与使用注意事项

  • 确保输入电压始终高于 Vout + 压差余量;在高负载场合考虑压差导致的功耗。
  • 在高电流应用中务必做好热仿真与 PCB 散热设计,避免进入热关断频繁触发。
  • 输出电容类型与 ESR 对稳定性与瞬态响应影响显著,应按照数据手册推荐选择与布局。
  • 如需更高效率或更低功耗方案,可考虑切换到开关型降压模块或功耗更优的 LDO 封装。

如需器件封装图、热阻参数或典型应用电路图,请参考 BL8071GCLATR33 的完整数据手册或联系供应商获取详细资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.