WMSIC Electronic Components

BLUE ROCKET BC846

ModelBC846
PackageSOT-23
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET BC846
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
BC846
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0225820702
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC846 产品概述(BLUE ROCKET)

一、产品简介

BC846 为一款 SOT-23 封装的 NPN 小信号晶体管(品牌:BLUE ROCKET),面向低功耗、小体积的开关和放大应用。该器件具有高直流电流增益与较低的截止电流,适合在电池供电或空间受限的电路中使用。包封为 SOT-23,便于表面贴装生产与自动化装配。

二、主要电气参数

  • 晶体管类型:NPN
  • 直流电流增益 (hFE):450 @ Ic≈2mA, Vce=5V(高增益,适合小信号放大)
  • 集电极电流 (Ic):最大 100mA(短时开关和驱动小负载)
  • 集射极击穿电压 (Vceo):65V(较高的耐压能力)
  • 射基极击穿电压 (Vebo):6V(注意基极-发射极极限)
  • 集电极截止电流 (Icbo):15nA(低漏电,有利于高阻与待机电路)
  • 特征频率 (fT):300MHz(适合高频小信号放大与高速开关)
  • 集射极饱和电压 (VCE(sat)):约 600mV @ Ic=100mA, Ib=5mA
  • 功耗耗散 (Pd):350mW(受限的功耗能力,需注意散热)

三、性能亮点及应用建议

  • 高 hFE(450@2mA)使其在小电流条件下能获得较大增益,适合低电平信号的前置放大、传感器接口和增益级。
  • fT=300MHz 表明器件在高频段仍有较好增益,适合用于宽带放大、射频前端的低功耗级或高速数字信号的驱动与整形。
  • Vceo=65V 与 Ic 最大 100mA 的组合允许用于中等电压和中小电流的开关场景,但应避免长时间满载运行以防过热。
  • 低 Icbo(15nA)利于低漏电、低功耗设计,适用于待机电流要求严格的便携设备。

应用建议:

  • 开关驱动时:确保基极驱动电流充足以满足饱和(参考 VCE(sat) 与 Ib),并在必要时使用限流或保护元件避免击穿。
  • 放大电路:在小信号放大器中利用其高 hFE,注意绕开基极反向电压超出 Vebo(6V)。
  • 高频用途:合理布局与阻抗匹配以发挥 300MHz 的特性。

四、封装与热管理注意事项

  • 封装:SOT-23,适合表面贴装与高密度布板。由于封装体积小,热阻相对较高,器件 Pd=350mW 在无额外散热条件下受限。
  • 使用时应关注封装温升与印制板散热路径:增大铜面积或使用热过孔可有效降低结温,延长寿命并保证可靠工作。
  • 注意基极-发射极反向保护,避免 E-B 反向电压超过 6V 导致损伤。

五、典型应用场景

  • 低电流小信号放大(传感器前置、仪表放大器)
  • 通用开关与驱动(继电器小驱动、指示灯驱动)
  • 高频/高速数字电路中的缓冲与整形
  • 低功耗设备的电源管理与电平转换

总结:BLUE ROCKET 标注的 BC846 在小封装下提供了高增益、低漏电与较好的频率响应,适合多种小信号与中低功率应用。设计时以热管理与电压、电流限值为主,合理偏置与布局可充分发挥其性能。

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