Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HSMR-C190 是 Broadcom(博通)推出的一款蓝色漫散射表面贴装芯片 LED,0603(1608 公制)封装。器件以窄带蓝光发射为主,适用于对体积和视角有严格要求的指示与背光应用。漫散射封装配合大视角设计,能在板面上提供均匀的可见指示效果,便于消费者电子、仪表及物联网终端的整机设计。
HSMR-C190 在典型 20 mA 驱动条件下表现稳定,正向压降约 3.4 V,发光强度 55 mcd(需参照厂方测试条件)。峰值发射约在 469 nm 附近,名义波长 473 nm,属近海洋蓝到纯蓝范围。155° 的半值角说明漫散射透镜提供了极宽的视场,适合做面光或广角指示。
需要注意的是:标称功率 78 mW 与 20 mA 工作时的实际耗能(≈68 mW)存在差异,通常可理解为器件允许的最大功耗边界与典型工作功耗之别。设计时应以最大允许功耗与环境温度、散热条件共同进行热平衡评估。
0603(1608)超小型 SMD 封装,适合高密度 PCB 布局与自动化贴装。漫散射外观能减少点光源直视眩光并提升板上可视均匀性。由于封装体积小,注意焊盘设计和回流焊工艺以确保可靠焊接并避免热应力损伤。
HSMR-C190 的工作温度范围为 -40 ℃ 至 +85 ℃,覆盖绝大多数工业与民用场景。设计时需考虑高温下的光输出衰减与颜色漂移,并对长期工作环境下的电流进行适当降额以延长寿命。建议在成品可靠性验证阶段执行焊接可靠性、湿热、温循环与寿命测试,以确认在特定整机条件下的表现。
在选型阶段请对比所需色点、亮度与视角需求,确认 55 mcd(典型)是否满足可视要求;若需更高亮度或更窄视角,应查看 Broadcom 的其他蓝色系列产品或联系供应商索取完整数据手册。批量采购前建议获取样品并在目标板上验证焊接、亮度与热特性。
如需更详细的电光数据、典型波形与封装尺寸图,请参考 Broadcom 官方数据手册或联系授权分销商获取完整规格说明。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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