WMSIC Electronic Components

Broadcom HCPL-M611-500E

ModelHCPL-M611-500E
Package5-SO
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Broadcom HCPL-M611-500E
Type
BROADCOM
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HCPL-M611-500E
Electronic Component
1
Package
5-SO
Electronic Component
Logic Output Optocoupler
Electronic Component
0.146g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
10kV/us
Electronic Component
10Mbps
Features
Collector Output
Electronic Component
BM0264721626
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V
Type
DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL-M611-500E 产品概述

概要

HCPL-M611-500E 是由 Broadcom (博通) 公司生产的一款高性能光隔离器,专为要求高隔离度和高速数据传输的应用场景设计。该设备采用表面贴装型(SOIC-5封装),提供了一种可靠、高速的方式来实现电气隔离和数据传输。

基础参数

  • 电流 - 输出/通道: 50mA
    • 每个输出通道能够提供高达 50mA 的电流,满足各种应用中的驱动需求。
  • 传播延迟 tpLH / tpHL(最大值): 75ns, 75ns
    • 低传播延迟确保数据信号在传输过程中保持高精度和低时延。
  • 数据速率: 10MBd
    • 支持高达 10 兆比特每秒的数据传输速率,适用于高速通信和控制系统。
  • 工作温度: -40°C ~ 85°C
    • 宽泛的工作温度范围,使其能够在各种环境条件下稳定运行。
  • 通道数: 1
    • 单通道设计,简化系统布局和成本。
  • 输入类型: DC
    • 直流输入类型,适用于各种直流信号源。
  • 安装类型: 表面贴装型
    • 使用 SOIC-5 封装,方便在 PCB 上进行表面贴装。
  • 电压 - 隔离: 3750Vrms
    • 提供高达 3750Vrms 的电气隔离,确保系统安全和可靠性。
  • 电压 - 正向 (Vf)(典型值): 1.5V
    • 低正向电压,减少能耗和热量产生。
  • 电流 - DC 正向 (If)(最大值): 20mA
    • 每个正向电流最大值为 20mA,满足一般应用中的驱动需求。
  • 共模瞬变抗扰度(最小值): 10kV/µs
    • 高共模瞬变抗扰度,能够抵御强电磁干扰,确保信号稳定性。
  • 电压 - 供电: 4.5V ~ 5.5V
    • 宽泛的供电电压范围,适用于不同电源系统。
  • 输出类型: 开集,肖特基箝位
    • 开集输出和肖特基箝位设计,提供快速切换和低功耗特性。
  • 上升/下降时间(典型值): 24ns,10ns
    • 快速上升和下降时间,确保高速数据传输的需求。

描述

HCPL-M611-500E 是一款专为逻辑输出应用设计的光隔离器。它支持高达 10MBd 的数据传输速率,并具有开集输出和肖特基箝位特性。这种设计不仅提高了设备的速度,还减少了能耗和热量产生。设备采用 SOIC-5 封装,易于在 PCB 上进行表面贴装。

应用场景

  • 工业控制系统
    • 在工业控制系统中,HCPL-M611-500E 可以用于隔离高电压设备与控制逻辑之间的信号,确保系统安全和可靠性。
  • 医疗设备
    • 医疗设备需要高隔离度来保护患者和操作人员。HCPL-M611-500E 的高电气隔离能力使其成为医疗设备中的理想选择。
  • 电力系统
    • 在电力系统中,HCPL-M611-500E 可以用于监控和控制高电压设备,提供实时数据反馈。
  • 汽车电子
    • 汽车电子系统中需要高速数据传输和高隔离度。HCPL-M611-500E 满足这些需求,适用于各种汽车电子应用。

优势

  • 高速数据传输
    • 支持高达 10MBd 的数据传输速率,满足高速通信和控制系统的需求。
  • 高电气隔离
    • 提供高达 3750Vrms 的电气隔离,确保系统安全和可靠性。
  • 低功耗
    • 低正向电压和快速切换特性减少能耗和热量产生。
  • 宽泛工作温度范围
    • 可在 -40°C ~ 85°C 的温度范围内稳定运行,适用于各种环境条件。

总结

HCPL-M611-500E 是一款高性能光隔离器,通过其高速数据传输能力、 高电气隔离度以及低功耗特性,成为工业控制、医疗设备、电力系统和汽车电子等领域的理想选择。其宽泛的工作温度范围和易于安装的表面贴装型封装,使其在各种应用中都能表现出色。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.