Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Broadcom HCPL-3120-560E
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Broadcom HCPL-3120-560E
- Type
- BROADCOM
- Unit
- Electronic Component
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BROADCOM
- Electronic Component
- HCPL-3120-560E
- Electronic Component
- 1
- Package
- SOP-8-2.54mm
- Electronic Component
- Logic Output Optocoupler
- Electronic Component
- 0.73g
- Electronic Component
- 1
- Channel Count
- 1
- CMTI(kV/us)
- 35kV/us
- Features
- Electronic Component
- Electronic Component
- BM0230874016
- Operating Temperature
- 40℃~+100℃
- Operating Voltage
- 15V~30V
- Type
- DC
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HCPL-3120-560E 产品概述
概要
HCPL-3120-560E 是由 Broadcom (博通) 公司生产的一款高性能光电耦合器，专为需要高隔离电压和快速切换时间的应用场景设计。以下是对此产品的详细介绍。
技术和功能
- 光学耦合技术: HCPL-3120-560E 采用光学耦合技术，通过光信号传递来实现电气隔离。这使得该器件能够在高电压环境下提供可靠的信号传输。
- 单通道设计: 该器件具有单通道结构，适用于需要单一信号传递的应用。
- 高隔离电压: HCPL-3120-560E 提供了 3750Vrms 的高隔离电压，这使得它能够在高压差环境下保持信号的完整性和安全性。
- 共模瞬变抗扰度: 该器件具有 25kV/µs 的共模瞬变抗扰度，这意味着它可以抵御快速变化的共模噪声，确保信号的稳定性。
性能参数
- 传播延迟: 传播延迟（tpLH 和 tpHL）最大值为 500ns，这表明该器件具有快速的响应时间，适用于需要实时处理信号的应用。
- 脉宽失真: 最大脉宽失真为 300ns，确保输出信号与输入信号保持同步。
- 上升/下降时间: 典型上升和下降时间分别为 100ns，这进一步突显了其快速切换能力。
- 输出电流: 输出高、低电流均为 2A，峰值输出电流可达 2.5A，满足高驱动能力的需求。
- 正向电压和电流: 典型正向电压（Vf）为 1.5V，最大直流正向电流（If）为 25mA。
工作条件
- 输出供电电压: 输出供电电压范围为 15V ~ 30V，适用于各种标准的电源系统。
- 工作温度: 工作温度范围从 -40°C 到 100°C，这使得 HCPL-3120-560E 可以在广泛的环境条件下运行。
封装和安装
- 封装类型: 采用 8-SMD 鸥翼封装，适合表面贴装工艺。
- 供应商器件封装: 同样为 8-SMD 鸥翼封装，确保兼容性和易于集成。
认证和安全性
- 认证机构: 该器件获得了 CSA、IEC/EN/DIN 和 UR 等多个认证机构的认可，确保其符合各种国际安全标准和规范。
应用场景
HCPL-3120-560E 因其高隔离电压、快速响应时间和高驱动能力，广泛应用于以下领域：
- 工业控制系统: 在工业控制系统中，需要隔离高压信号以确保安全和可靠性。
- 医疗设备: 医疗设备中常需要高隔离电压来保护患者和操作人员。
- 电力电子设备: 电力电子设备如变频器、逆变器等需要快速切换和高驱动能力。
- 自动化系统: 自动化系统中的传感器和执行器之间的信号传递也可以利用此器件。
总结
HCPL-3120-560E 是一款高性能光电耦合器，通过其卓越的隔离性能、快速响应时间和高驱动能力，成为各种需要可靠信号传递和电气隔离的应用场景中的理想选择。其广泛的工作温度范围和多个认证机构的认可进一步增强了其在不同行业中的适用性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
