WMSIC Electronic Components

Broadcom ACPL-064L-500E

ModelACPL-064L-500E
PackageSOIC-8
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Broadcom ACPL-064L-500E
Type
BROADCOM
Unit
Electronic Component
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
ACPL-064L-500E
Electronic Component
1
Package
SOIC-8
Electronic Component
Logic Output Optocoupler
Electronic Component
0.495g
Electronic Component
1
Channel Count
2
CMTI(kV/us)
20kV/us
Electronic Component
10Mbps
Features
Built-in Flip-Flop; Output; Collector Output
Electronic Component
BM0084330313
Operating Temperature
40℃~+105℃
Operating Voltage
2.7V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ACPL-064L-500E

简介: ACPL-064L-500E是博通(Broadcom)公司推出的一款高性能光耦合器,旨在满足各类工业和数据通信应用的需求。该产品具有双通道(2CH)设计,支持推挽式和图腾柱输出类型,提供可靠的信号传输和优异的电气隔离性能。

关键特性:

  • 通道数: 两个独立的光耦通道,可同时处理多个信号,合理利用空间,提高电路设计的灵活性。
  • 电压隔离: 具有3750Vrms的高电压隔离能力,确保信号在高压环境下的安全传输,适用于对电气隔离有严格要求的场合。
  • 共模瞬变抗扰度: 最小值达到20kV/µs,具备良好的抗干扰能力,适应复杂电磁环境,保护数据传输的稳定性。
  • 输入类型: 该产品支持直流(DC)输入,适合对高频信号传输有需求的场合。
  • 输出类型: 提供推挽式和图腾柱输出,这种灵活性使得ACPL-064L-500E可以兼容多种不同的应用需求。
  • 输出电流: 每个通道支持最高10mA的输出电流,能够满足大多数低功耗应用的要求。

数据传输能力:

  • 数据速率: 支持高达10MBd的数据传输速率,适合于高速数据通信的需求,例如在数据采集、工业自动化和通信设备中的应用。
  • 传播延迟: 最大传播延迟tpLH和tpHL均为80ns,确保信号在通道之间的快速传递,极大地缩短了整体系统的响应时间。
  • 上升/下降时间: 典型的上升和下降时间均为12ns,确保高频信号的稳定性和准确性,有效降低信号失真。

电源及工作环境:

  • 供电电压: 工作电压范围为2.7V至5.5V,适应不同电源配置,增加了设计的灵活性。
  • 工作温度: 适合在-40°C至105°C的宽温环境下工作,确保在各种严酷条件下的稳定性能,特别适用于工业、汽车等领域。

封装设计:

  • 封装形式: 使用8-SO封装(0.154",3.90mm宽),适合于表面贴装,方便与现代电子系统相兼容,节省板空间,提高安装效率。

应用场景: ACPL-064L-500E广泛应用于各类工业控制、数据通信、电机驱动、汽车电子等领域,尤其适合需要高速度、高隔离的应用场景。无论是在设计新产品还是在现有系统中集成该元件,它都能为用户提供可靠的性能和灵活的解决方案。

总结: ACPL-064L-500E是一款功能强大且灵活的光耦合器,凭借其优异的电气性能和适应性,成为了现代电子应用中不可或缺的组件。其高隔离电压、快速反应时间和宽广的工作温度范围,使其在要求严格的环境中同样表现出色,是工程师在设计电子电路时理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.