WMSIC Electronic Components

Broadcom HFBR-4503Z

ModelHFBR-4503Z
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
Broadcom HFBR-4503Z
Type
BROADCOM
Unit
Electronic Component
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HFBR-4503Z
Electronic Component
1
Type
Fiber Optic
Electronic Component
Fiber Optic Transceiver
Electronic Component
1.39g
Electronic Component
1
Electronic Component
BM0230859771
Operating Temperature
40℃~+85℃
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFBR-4503Z 产品概述(Broadcom 博通)

一、概述

HFBR-4503Z 为 Broadcom(博通)系列的光纤插头(CONN FIBER PLUG SMPLX,简单式单路光纤插头),为光纤互连提供可靠的机械与光学接口。该系列设计用于恶劣环境下稳定传输,工作温度范围为 -40℃ 至 +85℃,适合工业、通信设备和测试仪表等场合。

二、主要特性

  • 简单式(Simplex)结构,单通道光纤连接,体积小、密度高,便于布局与布线。
  • 采用耐温材料与精密陶瓷/镀层套筒(具体结构以厂家资料为准),确保插拔同轴对准与低插入损耗。
  • 具有良好的环境适应性与机械耐久性,适用于-40℃~+85℃的宽温工作条件。
  • 支持标准化光纤接口规范,兼容常见单模/多模光纤系统(请在选型时确认具体光纤类型与研磨形式)。

三、典型指标(参考)

  • 低插入损耗与高回波损耗是该类插头的设计目标,可实现稳定的光信号传输。
  • 机械寿命(插拔循环次数)、端面质量与阻抗匹配等参数会影响实际性能,建议以 Broadcom 官方数据表为准获取详细数值。

四、应用场景

  • 数据通信与电信设备的光纤跳线与模块连接。
  • 工业自动化与控制系统中的光纤传感与远程通信。
  • 仪器仪表、测试测量设备与医疗设备的光学输入/输出接口。
  • 需要耐振动、耐温差和长期稳定性的嵌入式系统。

五、安装与维护要点

  • 裸纤端面必须保持清洁,使用专用光纤清洁工具清除灰尘与油污,避免端面划痕。
  • 插拔动作应沿轴向平稳进行,避免侧向受力导致套筒或插芯偏移。
  • 安装时配合合适的应力释放与束缚方式,避免光纤过度弯曲或受力集中,确保弯曲半径满足光缆规格。
  • 定期检查插头端面和锁扣机构,必要时更换损耗上升或机械松动的部件。

六、选型与注意事项

  • 确认所需光纤类型(单模/多模)、端面研磨形式(UPC/APC)及工作波长,以保证光学兼容性。
  • 验证与之配合的插座/适配器型号,避免插接不匹配导致接触不良或损坏。
  • 在特殊环境(高湿、高盐雾或强振动)下使用时,参考厂商的额外防护或认证选项。
  • 最终参数(插入损耗、回波损耗、插拔寿命等)以 Broadcom 官方技术资料与样品测试为准。

七、结论

HFBR-4503Z 作为 Broadcom 的光纤简单式插头,面向需要可靠连接、宽温适应和高机械稳定性的场景。它在光学性能与机械强度之间取得平衡,是工业与通信级应用中常见的互连选择。选购与应用时,请结合实际的光纤类型、端面要求与环境条件,并参照 Broadcom 官方数据表进行验证和测试,以确保系统长期稳定运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.