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Broadcom HCPL-817-50BE
Configuration
1 options
Configuration
21+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Broadcom HCPL-817-50BE
- Type
- BROADCOM
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BROADCOM
- Electronic Component
- HCPL-817-50BE
- Electronic Component
- 1
- Package
- SMD-4P
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.54g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0230874135
- Operating Temperature
- 30℃~+100℃
- Load Voltage
- 70V
- Type
- DC
- Output Current
- 30mA
- Output Type
- Photoelectric Transistor
- (Pd)
- 200mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HCPL-817-50BE 产品概述
一、概述
HCPL-817-50BE 是 Broadcom（博通）出品的一款单通道光隔离器，输入为直流 LED，输出为光电三极管。器件在低正向电压（Vf≈1.2V）和较高电流传输比（CTR 50%~600%）下提供高达 5 kVrms 的隔离能力，适用于需要信号隔离与电气安全的场合，如开关电源反馈、微控制器接口、通信电路与工业控制信号隔离。
二、主要电气参数
- 输入（LED）：正向压降 Vf ≈ 1.2V，最大正向电流 If = 50mA（典型工作电流依据 CTR 要求选取）。
- 输出（光电三极管）：最大输出电流 30mA，最大负载电压（Collector-Emitter）可达 70V。
- 集射极饱和电压 VCE(sat)：约 100mV（条件例：20mA 和 1mA 输入参考条件下）。
- 反向耐压（LED）Vr = 6V。
- 隔离耐压：5 kVrms（绝缘等级适合常见工业与电源隔离应用）。
- 开关特性：上升时间 tr ≈ 4µs，下降时间 tf ≈ 3µs（适合中低速数字信号）。
- 环境与功耗：工作温度范围 -30℃ 至 +100℃，器件总功耗 Pd = 200mW。
- 封装：SMD-4P 表面贴装封装，单通道布局便于 PCB 布线与自动化组装。
三、特点与优势
- 高隔离电压（5 kVrms）提供可靠的安全隔离，适合在高压侧与低压侧之间传递控制或反馈信号。
- 宽幅 CTR（50% ~ 600%）使器件在不同输入电流下，能够灵活匹配不同的负载与灵敏度要求。
- 低 VCE(sat)（≈100mV）在开通状态下压降小，有利于降低功耗与热耗散。
- SMD-4P 小型封装适合高密度板面和自动化贴装，利于量产成本控制。
四、典型应用场景
- 开关电源（SMPS）反馈回路的光耦隔离。
- MCU 与高压电路之间的逻辑隔离与电平匹配。
- 工业控制信号隔离、继电器驱动前端保护。
- 通信接口中对地环路隔离与噪声抑制。
五、设计与使用建议
- 输入侧限流电阻按 R = (V驱动 - Vf)/I_LED 计算，考虑实际 CTR 与所需输出电流余量；若用于逻辑开关，常用 If 范围在 1–20mA。
- 由于输出为光电三极管，输出响应受负载与温度影响，若需要更稳定的数字输出可在集电极上拉至合适电平并使用缓冲器。
- 注意器件的最大功耗 Pd = 200mW 以及工作温度限制，必要时在 PCB 设计中留意散热与热沉兼容。
- 在具有严格安全标准的应用中，同时关注器件的爬电距离与爬电路径设计，确保整体系统满足相应的安全认证要求。
HCPL-817-50BE 以其高隔离能力、宽 CTR 范围与小封装形式，为要求电气隔离且对功耗与成本敏感的应用提供了实用且可靠的解决方案。
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