Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HCPL-0721-500E 是由 Broadcom (博通) 公司生产的一款高性能光电隔离器,专为需要高隔离电压和高速数据传输的应用场景设计。以下是对该产品的详细介绍。
HCPL-0721-500E 提供了高达 3750Vrms 的电压隔离,这使得它非常适合用于需要确保电气安全和可靠性的应用,如工业控制系统、医疗设备和电力电子设备。
该光电隔离器支持高达 25MBd 的数据传输速率,这使得它能够满足高速数字信号传输的需求。传播延迟仅为 40ns,确保信号传输的及时性和准确性。
HCPL-0721-500E 采用推挽式/图腾柱输出结构,这种结构可以提供更高的驱动能力和更好的抗噪性,特别适用于需要驱动较大负载的场景。
传播延迟仅为 40ns,上升和下降时间分别为 9ns 和 8ns,这些参数保证了信号传输的快速响应和高精度。
该产品的工作温度范围从 -40°C 到 85°C,这使得它可以在各种环境条件下稳定运行,适用于多种工业和商用应用。
在工业控制系统中,HCPL-0721-500E 可以用于隔离控制信号和电源信号,确保系统的安全性和可靠性。
由于其高隔离电压和高速数据传输能力,HCPL-0721-500E 非常适合用于医疗设备,如心脏除颤器、呼吸机等,确保患者的安全。
在电力电子设备中,如变频器、UPS 等,HCPL-0721-500E 可以用于隔离控制信号和电源信号,提高系统的可靠性和安全性。
该产品也可以应用于汽车电子系统中,如安全气囊控制系统、ABS 系统等,提供高隔离电压和高速数据传输能力。
HCPL-0721-500E 采用 8-SOIC 封装,宽度为 3.90mm,适合表面贴装工艺。这种封装形式便于在 PCB 上进行布局和焊接,提高了生产效率。
HCPL-0721-500E 是一款高性能光电隔离器,具有高隔离电压、高速数据传输能力、低延迟和快速上升/下降时间等优点。它广泛应用于工业控制系统、医疗设备、电力电子设备以及汽车电子系统等领域,为这些应用提供了可靠的信号隔离和传输解决方案。通过选择 HCPL-0721-500E,您可以确保您的系统具有高安全性、可靠性和性能。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products