WMSIC Electronic Components

Broadcom HCPL-0454-500E

ModelHCPL-0454-500E
PackageSOP-8
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Broadcom HCPL-0454-500E
Type
BROADCOM
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HCPL-0454-500E
Electronic Component
1
Package
SOP-8
Electronic Component
Logic Output Optocoupler
Electronic Component
0.168g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
15kV/us
Features
Collector Output
Electronic Component
BM0257666919
Operating Temperature
55℃~+100℃
Operating Voltage
4.5V~15V
Type
DC
Output Current
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL-0454-500E 产品概述

一、产品简介

HCPL-0454-500E 是 Broadcom(博通)推出的一款单通道光隔离器,采用晶体管输出结构,封装为 SOP-8(8-SO)。器件实现输入与输出之间高强度电气隔离,同时兼顾较好的抗共模瞬态能力和宽工作电压范围,适用于工业控制、通信接口、开关电源及其它需隔离的数字信号传输场合。

二、主要技术参数

  • 输入类型:DC
  • 工作电压:4.5 V ~ 15 V
  • 隔离电压(Vrms):3.75 kV
  • CMTI(共模瞬态免疫):15 kV/µs
  • CTR(电流传输比):21%
  • 通道数:1(单通道)
  • 工作温度:-55 ℃ ~ +100 ℃
  • 传播延迟:tpLH ≈ 500 ns、tpHL ≈ 700 ns
  • 输出电流:8 mA(典型/最大工作电流需参考应用条件)
  • 输入二极管正向压降 Vf:1.5 V
  • 直流反向耐压 Vr:5 V
  • 最大正向电流 If:25 mA
  • 封装:SOP-8(8-SO)

三、性能与特点

该光隔离器的主要优势在于高隔离强度(3.75 kVrms)与良好的共模瞬态抑制(15 kV/µs),能够在具有较大地电位差和强电磁干扰的环境中可靠工作。晶体管输出便于与常见数字逻辑电平或上拉电阻配合使用。器件的工作温度范围宽、封装紧凑,便于在工业级应用中设计布局。

四、典型应用场景

  • 微控制器与高电压侧线路的数字隔离接口
  • 开关电源与逆变器的驱动/反馈信号隔离
  • 工业自动化信号传输与地环路隔离
  • 通信接口与数据隔离场合

五、应用建议与注意事项

  1. 输入侧正向电流 If 不应超过 25 mA,以防器件损伤;通常按 CTR=21% 估算输出负载并选择合适的上拉电阻,使输出电流工作在典型 8 mA 范围内。
  2. 由于传播延迟 tpLH≈500 ns、tpHL≈700 ns,适用于中低速数字信号隔离;在对延迟敏感的高速链路应评估时延影响。
  3. 在布局时注意保持输入与输出之间的爬电距离和绝缘需求,遵循 PCB 隔离区布线规范;输出侧电源建议做充分去耦。
  4. 考虑环境温度,长期工作不要超过器件额定温度 +100 ℃,并留有热裕度。

六、封装与可靠性

SOP-8(8-SO)封装便于自动贴装与批量生产,机械强度和传统焊接工艺兼容。器件经过高压隔离设计与抗干扰能力优化,适配工业环境下的长期可靠性需求,但具体可靠性指标(寿命、应力测试等)请参阅厂商完整资料与认证报告。

总结:HCPL-0454-500E 是一款面向工业级隔离需求的单通道晶体管输出光隔离器,结合高隔离电压、良好 CMTI 与宽温度范围,可在多种需要电气隔离与抗干扰的应用中提供稳健的信号传输解决方案。若需详细电气特性曲线和典型应用电路,请参考 Broadcom 的官方数据手册。

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