WMSIC Electronic Components

Broadcom ACPL-339J-500E

ModelACPL-339J-500E
Package16-SO
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Broadcom ACPL-339J-500E
Type
BROADCOM
Unit
Electronic Component
Minimum package
850 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
ACPL-339J-500E
Electronic Component
1
Package
16-SO
Electronic Component
Logic Output Optocoupler
Electronic Component
0.937g
Electronic Component
1
Channel Count
2
CMTI(kV/us)
35kV/us
Features
Electronic Component
Electronic Component
BM0257618897
Operating Temperature
40℃~+105℃
Operating Voltage
3.3V~5.5V
Type
DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ACPL-339J-500E 产品概述

一、产品简介

ACPL-339J-500E 为 Broadcom(博通)出品的光隔离门极驱动器(OPTOISO),器件采用 16-SO 表面贴装封装,提供高电压隔离和高速共模抑制能力。器件工作电压范围为 3.3V 至 5.5V,适配常见的逻辑电平与门极驱动电源。器件设计用于电力电子开关(如 MOSFET/IGBT)驱动场合,支持严苛工业环境下的可靠隔离与快速切换。

二、核心性能参数

  • 输入类型:DC
  • 工作电压:3.3V ~ 5.5V
  • 隔离电压(Vrms):5 kV
  • CMTI(共模瞬变抗扰度):35 kV/µs
  • 通道数:2(双通道设计)
  • 工作温度:-40 ℃ ~ +105 ℃
  • 传播延迟 tpLH / tpHL:典型 150 ns / 150 ns
  • 输入阈值电流(FH):5 mA
  • 输出驱动峰值电流:5.5 A
  • 耗散功率 Pd:600 mW
  • LED 正向压降 Vf:1.55 V
  • 直流反向耐压 Vr:5 V
  • LED 最大正向电流 If:10 mA

(若需更详尽的极限参数和典型曲线,请参考官方 Datasheet。)

三、主要特点与优势

  • 强隔离能力:5 kV RMS 隔离等级满足工业级绝缘要求,有效保护低压控制侧与高压功率侧之间的安全隔离。
  • 出色的共模抗扰:35 kV/µs 的 CMTI 能力适用于高 dv/dt 场景,减少误触发风险。
  • 充分的驱动能力:5.5 A 输出电流适合驱动中大功率 MOSFET/IGBT,能实现较快上升/下降沿,降低开关损耗。
  • 宽工作电压与温度范围:3.35.5V 的供电适配常见逻辑电平,-40+105 ℃ 工作温度满足工业级应用。
  • 快速且对称的传播延迟:tpLH/tpHL 均为 150 ns,有利于双极性控制和时序一致性。

四、典型应用场景

  • 工业变频器与电机驱动
  • 光伏逆变器、太阳能充换电系统
  • 不间断电源(UPS)与电池管理系统(BMS)
  • 开关电源(SMPS)与高压功率转换器
  • 工业自动化与驱动控制板卡

五、设计与使用建议

  • 去耦与旁路电容:在 VCC 与 GND 之间靠近器件引脚放置低 ESR 去耦电容,抑制电源瞬变。
  • 栅极电阻与阻尼:结合被驱动功率器件,配置合适的栅极电阻以控制开关速度、减小振铃并满足热耗散要求。
  • PCB 布局:隔离区两侧保持足够爬电距离与过孔布局;高 dv/dt 区域走线短且避开弱信号回路。
  • 热管理:器件 Pd 为 600 mW,评估实际切换频率与占空比带来的功耗,必要时考虑散热措施。
  • 输入驱动:保证驱动端能提供满足 FH(5 mA)以上的 LED 电流,同时注意 If 不超过 10 mA 的限值;反向电压 Vr 最大为 5 V,避免反向损伤。

六、封装与可靠性

ACPL-339J-500E 采用 16-SO 表面贴装封装,适合自动化 SMT 生产。器件通过严格的绝缘与耐压测试,适合长期运行的工业环境。详细的焊接、回流温度曲线与可靠性测试规范以官方数据手册为准。

七、注意事项

在高频或高功率切换场合,请结合被驱动器件的门极电荷(Qg)与系统拓扑评估栅极驱动器的平均与脉冲功耗。器件性能参数为典型值或推荐值,最终设计应以 Broadcom 官方 Datasheet 与可靠性报告为依据,并在样机阶段完成电磁兼容(EMC)与绝缘验证。

如需获取引脚排列、时序图与完整电气特性,请参阅 Broadcom ACPL-339J-500E 官方资料,或提供系统应用场景以便给出更具体的电路与布局建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.