WMSIC Electronic Components

Broadcom HCPL-3120-000E

ModelHCPL-3120-000E
PackageDIP-8
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Broadcom HCPL-3120-000E
Type
BROADCOM
Minimum package
500 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HCPL-3120-000E
Electronic Component
1
Package
DIP-8
Electronic Component
Logic Output Optocoupler
Electronic Component
1.08g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
35kV/us
Features
Electronic Component
Electronic Component
BM0257393003
Operating Temperature
40℃~+100℃
Operating Voltage
15V~30V
Type
DC
Output Current
2.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL-3120-000E 产品概述

一、简介

HCPL-3120-000E 为 Broadcom(博通)出品的单通道隔离型栅极驱动光耦,采用 DIP-8 封装,面向 IGBT/MOSFET 驱动等功率电子场合。器件输入为 LED 驱动(DC),输出为隔离的推挽驱动级,能够为功率器件提供高达 2.5A 的瞬态输出电流,满足快速开关需求同时保持高电气隔离性能。

二、主要规格(关键参数)

  • 输入类型:DC(LED 驱动)
  • 工作电压(输出侧 VCC):15V ~ 30V
  • 隔离电压(Vrms):3.75 kV
  • 共模瞬变抗扰度(CMTI):35 kV/µs
  • 通道数:1
  • 工作温度:-40 ℃ ~ +100 ℃
  • 传播延迟 tpLH / tpHL:约 500 ns / 500 ns
  • 输入阈值电流(FH):8 mA(保证翻转)
  • 正向电流 If:16 mA(LED 正向额定)
  • 输出电流:2.5 A(峰值源/吸)
  • 耗散功率 Pd:295 mW
  • LED 正向压降 Vf:1.8 V
  • LED 直流反向耐压 Vr:5 V
  • 封装:DIP-8

三、功能与优势

  • 高隔离强度(3.75 kVrms)适合高压侧与控制侧的电气隔离要求;CMTI 达 35 kV/µs,可在高 dv/dt 环境下维持稳定输出,降低误触发风险。
  • 输出级具备高瞬态电流能力(2.5A),可实现对栅极的快速充放电,缩短开关过渡时间,降低开关损耗。
  • 宽工作电压(15–30V)兼容常见栅极驱动电压,便于在不同电路拓扑中使用。
  • 双向近似对称的传播延迟(500 ns)便于精确时序控制与多通道并联应用的时序匹配。

四、典型应用场景

  • 逆变器与电机驱动(IGBT/MOSFET 驱动)
  • 开关电源与 PFC 电路的高压侧驱动
  • 光伏逆变器、UPS、工业电源等需要高隔离和高 CMTI 的电力电子场合

五、设计与使用建议

  • 输入侧:LED 驱动电流应满足或超过输入阈值(FH=8 mA)以保证可靠驱通,但不得超过 If(16 mA)或器件手册规定的峰值值。LED 两端串联适当限流电阻。
  • 输出侧:选择合适的栅阻以限制峰值电流并控制开关速度;在 15V 驱动电压下略大栅阻可减小 EMI 与振荡。
  • 去耦与布板:在 VCC 与 GND 之间靠近器件放置 0.1 µF 陶瓷去耦电容,最小化回路面积;输出回路线尽量短且粗。
  • 保护:为防止栅极过压或负向峰值,可并联 TVS 或栅极钳位器件,并在必要时加吸收网络(RC)或缓冲电路。
  • 热管理:注意器件 Pd(295 mW)及工作温度范围,保证封装散热条件,避免长期在高耗散状态下工作。

六、可靠性与合规

HCPL-3120-000E 在满足 3.75 kVrms 隔离及 -40 ℃ 至 +100 ℃ 工作温域的同时,具有较高的共模瞬变抗扰能力,适用于严格的工业电气隔离要求。设计时应遵守爬电距离与绝缘材料规范,保证系统整体现场安全与长期可靠性。

如需更详细的电气特性曲线、引脚定义与布局示意,请参阅厂商数据手册以获得完整参数与典型应用电路。

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