WMSIC Electronic Components

Broadcom HCPL-M600-500E

ModelHCPL-M600-500E
PackageSOP-5-175mil
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Broadcom HCPL-M600-500E
Type
BROADCOM
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HCPL-M600-500E
Electronic Component
1
Package
SOP-5-175mil
Electronic Component
Logic Output Optocoupler
Electronic Component
0.413g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
10kV/us
Electronic Component
10Mbps
Features
Collector Output
Electronic Component
BM0257666918
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V
Type
DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL‑M600‑500E 产品概述

一、概述

HCPL‑M600‑500E(Broadcom/博通)是一款单通道逻辑输出型光隔离器,适用于高可靠性数字隔离场合。器件在5V工作电源下提供开集电极输出,集成肖特基箝位以加速开关并降低饱和压降。该器件支持高达10Mbps的传输速率,典型传输延迟为tpLH=75ns、tpHL=75ns,适合高速数字信号隔离。

二、主要性能指标

  • 输入类型:DC(LED输入);正向电压 Vf ≈ 1.5V(If=20mA时)
  • 输入驱动:典型阈值电流 FH = 15mA,最大正向电流 If = 20mA
  • 工作电源:VCC = 4.5V ~ 5.5V
  • 输出:开集电极(需外置上拉);最大输出电流可达 50mA(下拉能力)
  • 隔离等级:隔离电压 3.75 kVrms(reinforced 类似等级)
  • 抗瞬态共模能力:CMTI = 10 kV/μs(标准)
  • 传输速率:10 Mbps(10 MBd)
  • 时延:tpLH/ tpHL ≈ 75 ns
  • 工作温度:−40 ℃ ~ +85 ℃
  • 功耗:最大耗散功率 Pd = 85 mW
  • 封装:SOP‑5,175 mil 宽

三、封装与接口要点

HCPL‑M600‑500E 使用 5 引脚 SOP 封装,输入侧为 LED,输出侧为开集电极晶体管并带肖特基箝位(用于改善下降沿及限制 VCE(sat))。输出需通过外部上拉电阻连接到所需逻辑电平(通常为5V)。器件体积适合 PCB 密度设计,并利于保持较大爬电/间隙距离以满足隔离要求。

四、典型应用

  • 工业控制与 PLC 的逻辑隔离
  • 电机驱动与逆变器控制信号隔离
  • 开关电源(SMPS)主控与次级之间的数据信号隔离
  • 电池管理、太阳能逆变器与测量系统的安全隔离
  • 通信接口隔离(TTL/CMOS 至高压/噪声环境)

五、设计注意事项

  • 输入驱动电流应保证高电平输入至少达到或超过阈值 FH(约15mA),但不应长期超过 If 最大值(20mA),以免降低 LED 寿命。
  • 输出为开集电极结构,须配置合适上拉电阻,上拉电压不得超出 4.5–5.5V 范围及器件最大额定。
  • 关注总耗散 Pd(85mW)与环境温度,必要时评估 PCB 散热与功率限制。
  • 对于高共模干扰环境,应考虑器件 CMTI(10 kV/μs)能力并优化接地、走线和去耦以保证可靠传输。
  • 保持隔离端的爬电距离与穿越距离,遵循最终系统的安规要求。

六、总结

HCPL‑M600‑500E 结合了高隔离电压、较高 CMTI 与 10Mbps 的传输能力,适用于对速度、抗干扰和安全隔离有较高要求的工业与电力电子应用。合理设计输入驱动与输出上拉、电源去耦及热管理,可实现稳定、长期的隔离数字传输。

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