WMSIC Electronic Components

Broadcom ASMT-UWB1-NX3B2

ModelASMT-UWB1-NX3B2
Package4-SMD
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Broadcom ASMT-UWB1-NX3B2
Type
BROADCOM
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
ASMT-UWB1-NX3B2
Electronic Component
1
Package
4-SMD
Electronic Component
LEDDiode / LED
Electronic Component
6500K
Electronic Component
0.26g
Electronic Component
1
LED
1.8cd~3.55cd
LED
120°
LED
Electronic Component
Electronic Component
BM0257801106
Operating Temperature
40℃~+100℃
(Vf)
2.4V~3.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ASMT-UWB1-NX3B2 产品概述

一、产品简介

ASMT-UWB1-NX3B2 为 Broadcom(博通)出品的一款高亮度冷白光表面贴装(SMD)LED,采用 2-PLCC(4-SMD)扁平引线裸焊盘封装,外观为圆形平顶透镜并带散射处理。器件以冷白(约 6500K)主色温输出,透镜呈黄色(典型为蓝芯+黄色荧光粉形成白光),在标准测试电流 20 mA 条件下具有良好的光通性能与宽视角分布,适合多种指示和照明类应用。

二、主要参数一览

  • 制造商:Broadcom Limited(博通)
  • 封装:4-SMD,扁平引线裸焊盘(供应商器件封装标示为 2-PLCC)
  • 封装尺寸(外形):3.20 mm × 2.80 mm(长 × 宽),最大高度 2.10 mm
  • 透镜:圆形,平顶,黄色透镜,散射(均匀出光)
  • 发光颜色 / 主波长:冷白,主色温约 6500 K
  • 发光强度(毫烛光):2300 mcd(测试条件:20 mA)
  • 典型正向电压 Vf:3.2 V(测试电流 20 mA)
  • 测试电流:20 mA(典型)
  • 视角:120°(宽视角,利于面光均匀)
  • 包装:卷带(TR),器件状态:有源

三、光学与电气特性说明

该器件在 20 mA 驱动时能提供约 2300 mcd 的单点亮度输出,配合 120° 宽视角和散射透镜设计,可在小尺寸封装下实现较平滑的出光分布,适合做指示灯、照明点光源或小面积面光源。典型正向电压为 3.2 V,对应在 20 mA 时的电功耗约为 64 mW(P = Vf × I),热量较小但仍需注意 PCB 散热设计以保证长期稳定性与颜色一致性。

注意:所列光电参数为典型测量值,实际件别(bin)之间会有光强、色温及 Vf 的分布差异,批量选型时建议参考完整数据手册并按需要索取色彩/光强分bin。

四、封装与安装要点

ASMT-UWB1-NX3B2 采用 2-PLCC(4-SMD)扁平引线裸焊盘封装,尺寸紧凑,适用于高密度贴片组装。推荐采用标准 SMD 回流焊工艺安装:

  • 建议遵循制造商回流曲线(Pb‑free)进行焊接,避免超出温度和时间限制导致荧光粉或透镜变色。
  • 安装时注意焊盘与器件方向的一致性,正确识别极性(详细极性标识请参照官方机械图或封装图纸)。
  • 为保证光学一致性与散热,PCB 上可在焊盘附近配置适量铜箔以帮助热量扩散。

五、典型应用场景

  • 消费电子:指示灯、功能指示、键盘背光等
  • 工业/仪器面板:状态指示、信号提示
  • 商用终端:POS、家电指示灯
  • 小型照明模块:装饰照明、显示器边缘照明等
    由于该器件未特指车规级认证,若用于汽车或安全关键场景,请确认产品是否满足相应可靠性与规范要求。

六、包装与订购信息

  • 包装方式:卷带(TR),便于自动贴片生产线直接使用。
  • 订购型号通常包含器件型号 + bin/颜色/包装后缀(例如 ASMT-UWB1-NX3B2),具体后缀含义与可用 bin 请咨询供应商或参考正式数据手册与库存表。

七、存储与搬运建议

  • 建议按通用 SMD LED 管理办法存放:保持原装防潮袋密封,避免长期暴露在高湿环境中。
  • 若超出规定时间或封装破损,建议按厂家建议进行烘烤处理后再进行回流焊。
  • 在贴装过程中避免强烈机械压迫透镜或刮伤,避免长时间高温或紫外线直射导致透镜/荧光粉老化。

八、选型与可靠性提示

在设计时,应根据应用的亮度、色温一致性及驱动条件选择合适 bin(若对亮度或色温有要求,建议进行 bin 分选)。同时关注长期驱动电流、环境温度对亮度衰减(Lumen depreciation)和色温漂移的影响,并在 PCB 布局中预留足够的散热路径以延长器件寿命。最终设计建议以 Broadcom 官方数据手册与可靠性报告为准。

如需更详细的电气特性曲线、机械图、回流焊曲线或 bin 列表,可提供我来帮您检索或整理厂方资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.