Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BAT WIRELESS BW0033BG-.4W0.9H2.0 BW0033BG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- BAT WIRELESS BW0033BG-L3.4W0.9H2.0
- Type
- BAT WIRELESS
- Minimum package
- 6000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BAT WIRELESS
- Electronic Component
- BW0033BG-L3.4W0.9H2.0
- Electronic Component
- 1
- Electronic Component
- 1.5*3.4mm
- Electronic Component
- Electronic Component
- Electronic Component
- Other Module
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Electronic Component
- BM0264354957
- Electronic Component
- Electronic Component
- Electronic Component
- 6000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BW0033BG-L3.4W0.9H2.0 产品概述
一、产品简介
BW0033BG-L3.4W0.9H2.0 为 BAT WIRELESS（蝙蝠无线）系列的一款微型不锈钢零件。标注尺寸常见为 3.4×0.9×2.0 mm（长×宽×高），另有资料中出现 1.5×3.4 mm 的尺寸标示，具体以最终出货图纸为准。材质为不锈钢，外形紧凑，适用于对体积、强度与耐腐蚀性有要求的微型装配场合。
二、主要特点
- 微型化外形：长宽高仅为 3.4×0.9×2.0 mm，便于在空间受限的消费电子与物联网终端中集成。
- 不锈钢材质：具备良好的耐腐蚀性与机械强度，适合长期可靠性要求较高的使用环境。
- 加工精度高：适用于精密冲压、激光切割或微铣加工，尺寸一致性好，便于批量装配。
- 封装灵活：图纸标注无特定封装（“-”），可按客户需求采用散装、盘装或托盘供货。
三、典型应用场景
- 无线耳机、可穿戴设备等微型消费电子的结构件或支撑件；
- 机壳内部的定位销、卡件或接触弹片（需经表面处理或电镀以满足导电性要求）；
- 工业传感器、小型执行机构等对耐腐蚀与强度有要求的部位；
- 需做进一步表面处理（如电镀、钝化）后用于电气接触的元件。
四、装配与兼容建议
- 装配方式：建议采用精密贴装、机械压配或微型螺钉固定；若用于电接触，可考虑点焊或超声焊接（视不锈钢类型与后处理而定）。
- PCB布局：因体积极小，预留安装空间与受力区时应考虑装配公差与应力分布，避免在薄壁区域产生过大变形。
- 表面处理：若需要改善导电性或焊接性，推荐做镀金、镀镍等工艺；若用于裸露结构件，可采用钝化或喷砂美化表面。
五、使用与储存注意事项
- 避免在高应力冲击下变形，搬运时慎用硬物直接挤压；
- 长期储存建议置于干燥、常温环境，防止污染物附着影响后续处理；
- 表面有二次电镀或清洗要求时，按工艺规范操作，以免影响尺寸与性能。
六、品质与定制支持
蝙蝠无线可根据客户需求提供图纸确认、材料检测报告、批量检验记录及必要的表面处理定制。对于特殊尺寸、公差或表面要求，建议先沟通样件确认后再进行小批试产与量产。
如需详细三视图、材料牌号或装配建议，请提供用途与装配条件，我方可协助评估并给出更精确的技术方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
