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CJ RB751S-40 RB751S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ RB751S-40
- Type
- CJ
- Minimum package
- 8000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- RB751S-40
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0229991270
- Current
- 30mA
- Diode
- 1
- Current(Ir)
- 500nA@30V
- (Vf)
- 370mV@1mA
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RB751S-40 产品概述
一、产品简介
RB751S-40 为一款小封装的肖特基势垒二极管，适用于极低正向压降和低电流场合。该器件由 CJ（江苏长电/长晶）品牌提供，封装为 SOD-523，体积非常小，便于高密度表贴电路的空间布局。典型应用包括便携设备的电源路径、信号整流、反向保护与电平检测等场合。
二、主要电气参数
- 正向压降（Vf）：约 370 mV @ If = 1 mA（低电流下表现优秀，减少压降相关损耗）
- 直流反向耐压（Vr）：30 V（可用于一般低压电源与信号线）
- 最大整流电流（If）：30 mA（连续工作电流，适合小功率场合）
- 反向电流（Ir）：500 nA @ 30 V（反向漏电小，有利于待机和低功耗设计）
- 非重复峰值浪涌电流（Ifsm）：200 mA（允许短时浪涌，但不可作为长期承载）
- 封装：SOD-523（超小型表贴封装，适合高密度 PCB 布局）
三、主要特点与优势
- 低正向压降：在 1 mA 工作点上仅约 0.37 V，适合要求低压降的电源路径或信号整流，能降低功耗与发热。
- 低反向漏电：在最大反向电压下反向电流仅数百纳安，适用于待机电流敏感的便携设备与电池供电系统。
- 小封装：SOD-523 体积小，便于空间受限的移动终端与消费电子产品。
- 适合小功率场合：30 mA 连续电流与短时 200 mA 浪涌能力，满足一般信号和弱电源保护需求。
四、典型应用场景
- 电池反向接入保护与反向电源保护（低压差、降低功耗）
- 小电流整流与二极管逻辑隔离（例如检测、参考路径）
- 信号线的钳位或保护元件（对瞬态浪涌具有限度承受能力）
- 便携式与穿戴类产品的电源管理与低功耗电路
五、设计与使用建议
- 额定整流电流为 30 mA，长时间工作或高环境温度下应适当降低负载电流以避免热失控。
- 浪涌能力为 200 mA（非重复峰值），用于瞬态保护时仍需谨慎，不宜作为常态承载标准。
- 在高温环境下反向漏电会增加，若电路对漏电极其敏感，应在实际温度条件下验证。
- 封装极小，应注意焊接与回流工艺，遵循厂商推荐的贴片与回流规范以保证可靠性。
- 布局时将二极管靠近被保护器件或电源引出点放置，缩短导线长度以降低寄生阻抗与串联电感。
六、可靠性与存储
- SOD-523 为常见表贴封装，适用标准 SMT 回流工艺。为保证器件可靠性，请按厂商提供的焊接及储存湿敏等级（MSL）说明进行操作与储存。
- 在装配与调试阶段注意静电防护与机械应力，避免在焊接或维修过程中损伤器件。
总结：RB751S-40 是一款面向低电流、低压降、小尺寸应用的肖特基二极管，适合便携式、消费电子与低功耗电路中的整流与保护需求。设计时关注持续电流、散热与高温下的漏电特性，可发挥其在节能与空间受限场合的优势。
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