WMSIC Electronic Components

cjiang FNTC0201X103F3380FB

ModelFNTC0201X103F3380FB
Package0201
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FNTC0201X103F3380FB
Type
CJIANG
Minimum package
15000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FNTC0201X103F3380FB
Electronic Component
1
Electronic Component
0.3mm
Package
0201
Electronic Component
NTCThermistor Resistor
Electronic Component
0.009g
Electronic Component
0.6mm
Electronic Component
10kΩ
Electronic Component
0.3mm
Electronic Component
1
B
±1%
Electronic Component
BM0264590594
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FNTC0201X103F3380FB 产品概述

一、产品简介

FNTC0201X103F3380FB 为 cjiang(长江微电)0201 封装高精度 NTC 热敏电阻。器件采用氧化锰、氧化钴、氧化镍等多种金属氧化物经高温烧制成陶瓷体,表面覆银电极并镀镍/锡,形成片式结构。该元件为负温度系数(NTC),在温度上升时阻值快速下降,适合温度检测与温度控制场合。

二、主要规格(典型值)

  • 标称阻值:10 kΩ(25℃)±1%
  • B值精度:±1%
  • B值:B(25℃/50℃)=3380 K;B(25℃/85℃)=3435 K
  • 最大额定功率:100 mW
  • 最大稳态电流(25℃):310 μA(对应最大稳态电压约 3.1 V)
  • 耗散系数:1 mW/℃(热阻)
  • 热时间常数:3 s
  • 工作温度:-40 ℃ ~ +125 ℃
  • 尺寸(封装 0201):0.6 mm × 0.3 mm × 0.3 mm

三、温度—阻值关系与示例

NTC 热敏电阻的温度特性可用标准公式描述:R(T)=R25·exp[B·(1/(T+273.15)−1/298.15)]。以本型号为例,25℃ 时为 10 kΩ,近似阻值:

  • 50℃(使用 B(25/50)=3380K):约 4.14 kΩ
  • 85℃(使用 B(25/85)=3435K):约 1.45 kΩ
    (以上为近似计算示例,实际电阻受制造公差与环境影响)

四、性能亮点

  • 高精度:阻值与 B 值均为 ±1%,适合需要高线性与高重复性的测温应用。
  • 快速响应:小体积与 3 s 热时间常数,适合快速检测场合。
  • 宽工作温度范围:-40 ℃ 至 +125 ℃,满足工业级环境要求。
  • 小尺寸:0201 封装便于空间受限的移动设备与可穿戴场景。

五、应用建议

  • 温度检测与控制:如电池温度监测、充放电保护、系统过温检测。
  • 温度补偿:用于传感器、晶振或模拟电路的温度漂移补偿。
  • 小型化电子设备:智能手表、无线耳机、IoT 终端等空间受限场景。
    设计时建议在分压测量电路中选择与被测温区阻值相近的上拉/下拉电阻以获得最佳灵敏度;同时限制通过 NTC 的电流低于其最大稳态电流以避免自热影响测量精度。

六、使用与焊接建议

  • 焊接工艺:建议采用无铅回流焊工艺,峰值温度≤260 ℃、在峰值温度的时间尽量短(例如 ≤10 s),以避免过热损伤。
  • PCB 布局:0201 体积极小,焊盘尺寸应按供应商推荐值设计;避免大面积铜箔直接贴近元件一侧,以减少热传导对测量的影响;如需更精确测温,使用热隔离结构或悬空安装。
  • 防静电与加工:小尺寸器件在贴装过程中需防止机械应力与飞散,建议使用自动贴装设备并采用适当的吸嘴与定位。

七、注意事项与选型提示

  • 自热与功率限值:虽然额定功率为 100 mW,但器件的耗散系数为 1 mW/℃,在连续工作时应控制功耗以限制自热。最大稳态电流 310 μA 已给出连续工作参考。
  • 环境可靠性:适用于工业温度范围,具体可靠性测试(如温度循环、湿热等)请参照供应商详细资料。
  • 选型:型号中“103”表示 10 kΩ,B 值信息(3380)用于确认热敏特性,订购或批量设计时请与供应商确认包装、出货形式及物料编码。

如需电路接法示意、精确阻值随温度曲线图或封装推荐焊盘尺寸图,我可提供进一步资料与计算示例。

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