WMSIC Electronic Components

cjiang FTC252012S2R2MBCD

ModelFTC252012S2R2MBCD
Package1008
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC252012S2R2MBCD
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC252012S2R2MBCD
Electronic Component
1
Package
1008
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.064g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0264754163
Current
3.9A
Resistor(DCR)
60mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
4.1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC252012S2R2MBCD 产品概述

一、产品简介

FTC252012S2R2MBCD 为 cjiang(长江微电)推出的一款小体积超大电流贴片电感。采用一体成型 T‑CORE 结构与扁线工艺,体积紧凑(封装 1008),设计面向高电流、空间受限的开关电源和电源管理模块,兼顾导磁效率与热散能力,适用于移动电源、DC‑DC 降压模块及车载电子等场景。

二、主要参数

  • 电感值:2.2 μH(公差 ±20%)
  • 额定电流:3.9 A(连续工作参考值)
  • 饱和电流(Isat):4.1 A(磁芯不产生显著电感下降的极限值)
  • 直流电阻(DCR):≈60 mΩ
  • 封装型号:1008(贴片封装)
  • 特性:一体成型 T‑CORE,扁线绕制,小感值设计

三、核心优势

  • 小体积、高电流承载:扁线与一体化结构使得在有限空间内实现较高额定电流与较低 DCR,适合高功率密度应用。
  • 稳定的磁性能:T‑CORE 结构改善磁通路径,降低漏磁和谐波损耗,有助于提高转换效率。
  • 高可靠性:成型工艺和封装适配自动贴片生产,良好的机械强度和焊接一致性。

四、典型应用

  • 移动电源与USB PD快充方案中的输出滤波与能量传输
  • 手机、平板等便携设备内部 DC‑DC 降压模块
  • 工业/车载电源模块,要求抗冲击和高瞬态电流能力的场景
  • LED 驱动、电源滤波与EMI抑制电路

五、封装与布局建议

  • 尽量紧靠开关管/整流器放置,以缩短高电流回路的走线,减少寄生电感和损耗。
  • 用宽铜箔短引线连接,必要时在电感两端增加多点焊接或加宽焊盘。
  • 保留足够的散热铜皮与过孔(如果基板允许),提升导热至基板的能力。
  • 远离敏感模拟信号线与闭环参考,避免磁耦合引入误差。

六、热与电磁兼容考虑

  • 连续工作电流建议留有余量(一般按额定电流的 80% 以内长期使用),以减少温升和磁饱和风险。
  • 在高脉冲或瞬态条件下注意 Isat 限值,避免工作点进入饱和区导致电感骤降。
  • 配合布局、屏蔽和滤波措施可有效降低 EMI 辐射与传导噪声。

七、选型与注意事项

  • 如需更低 DCR 或更高电流承载,请参考同系列或定制化产品,以满足更苛刻的热平衡与效率要求。
  • 采购与检验时关注批次一致性、外观无裂纹、焊盘涂层均匀以及电感值与 DCR 的出厂测试报告。
  • 如用于汽车电子或高可靠性场合,请与厂商确认资质、温度等级和相关资格认证。

如需等效电路、频率响应曲线或在特定工作点下的磁滞与温升数据,可提供更详细的测试报告以便做进一步的设计校核。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.