WMSIC Electronic Components

cjiang FXL0630-330-M FXL0630

ModelFXL0630-330-M
PackageSMD,6.6x7mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FXL0630-330-M
Type
CJIANG
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FXL0630-330-M
Electronic Component
1
Package
SMD,6.6x7mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.048g
Inductor
33uH
Electronic Component
1
Electronic Component
BM0230945273
Current
2A
Resistor(DCR)
310mΩ
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXL0630-330-M 产品概述

FXL0630-330-M 为 cjiang(长江微电)推出的一体成型功率电感,面向中小电流电源与滤波应用。产品封装为贴片式 SMD,外形尺寸约 6.6 × 7 mm,电感值为 33 μH,允许偏差 ±20%,额定电流 2.0 A,直流电阻(DCR)约 310 mΩ,饱和电流(Isat)为 2.5 A。结构为一体成型(molded)外壳,便于自动贴装与回流焊工艺。

一、主要特性

  • 电感值:33 μH,公差 ±20%
  • 额定电流:2.0 A(长期安全工作参考值)
  • 饱和电流:2.5 A(最大值,超过此值电感显著下降)
  • 直流电阻(DCR):≈ 310 mΩ
  • 封装:SMD,尺寸约 6.6 × 7 mm
  • 类型:一体成型功率电感,品牌:cjiang(长江微电)

二、性能与应用建议

  • 典型应用:DC-DC 降压/升压电源中的能量储存、电源输入滤波、负载供电滤波、EMI 抑制及一般开关电源滤波电路。
  • 电流与功耗考虑:在额定电流 2 A 条件下,由于 DCR≈0.31 Ω,铜损 P = I^2·DCR ≈ 1.24 W(2 A 情况下),实际应用时需评估散热条件与效率损失。若对损耗/温升敏感,应留有裕量或选用更低 DCR 的型号。
  • 饱和裕量:Isat 2.5 A 表示在短时冲击或峰值电流下仍能维持电感特性,但长期工作电流应以额定电流为准以避免磁饱和与过热。

三、选型与布局注意事项

  • 若系统连续输出电流接近或超过 1.5–2.0 A,应特别关注器件发热与 PCB 散热路径,建议在器件下方和周围采用较宽的铜箔来辅助散热。
  • 高效率电源建议优先考虑 DCR 更低的器件;若电路对体积或成本敏感且允许较大损耗,本款器件以较小封装提供较高电感量,适用于低开关频率或作为滤波元件。
  • 布局建议:贴片放置靠近电源管脚,输入/输出走线最短并加宽以降低串联阻抗;必要时配合隔离及磁环布局以减小干扰耦合。

四、安装与可靠性提示

  • 建议采用标准无铅回流焊工艺,遵循厂方推荐的回流温度曲线与焊接工艺控制。
  • 储存与处理按常规 SMD 器件要求,避免潮湿环境长时间暴露,必要时按厂家建议进行干燥回流前的烘烤处理。
  • 装配时避免受到机械冲击或过度弯曲 PCB,防止封装破损或引脚焊接应力导致可靠性下降。

五、测试与技术支持

  • 在实际应用中建议做温升测试、纹波电流下的电感变化测试和饱和测试,以确认在工作工况下性能满足系统要求。
  • 如需更详细的等效电路参数(如自谐频率、交流阻抗、温度特性曲线、焊盘尺寸及封装三维图),请联系 cjiang(长江微电)或索取完整数据手册与样品验证。

总结:FXL0630-330-M 以紧凑 SMD 封装提供 33 μH 的电感量,适合对体积和电感量有要求的滤波与电源应用,但在中高电流场合需注意其较高的 DCR 所导致的功耗与温升,选型时请综合电流、效率与散热需求。

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