WMSIC Electronic Components

cjiang FTC303020D1R5MBCA

ModelFTC303020D1R5MBCA
PackageSMD,3.0x3.0mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC303020D1R5MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC303020D1R5MBCA
Electronic Component
1
Package
SMD,3.0x3.0mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.235g
Inductor
1.5uH
Electronic Component
1
Electronic Component
BM0258711146
Current
6.3A
Resistor(DCR)
19mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
7A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC303020D1R5MBCA 产品概述

一、产品简介

FTC303020D1R5MBCA 是长江微电(cjiang)推出的一款表面贴装功率电感,封装尺寸 3.0×3.0mm(SMD),额定电感值 1.5µH,公差 ±20%。该器件针对空间受限且对大电流和低损耗有严格要求的开关电源及功率管理应用而设计,兼顾体积、抗饱和能力与导通损耗,适合主流降压转换器(Buck)、电源模块及点到点供电场景。

二、主要特点

  • 紧凑封装:3×3mm SMD 适合高密度 PCB 布局与自动化贴装。
  • 大电流能力:额定电流 6.3A,饱和电流(Isat)7A,能承受开关电源中的较大直流偏置与瞬态峰值。
  • 低直流电阻:DCR≈19mΩ,降低直流损耗,有利于提高转换效率。
  • 工艺稳定:绕线与磁芯设计优化,保证在高电流下的稳定性与重复性。

三、关键参数

  • 电感值:1.5µH ±20%
  • 额定电流(Irms / 连续):6.3A
  • 饱和电流(Isat):7A(定义为电感降至初始值一定比例时的峰值电流)
  • 直流电阻(DCR):约 19mΩ
  • 封装:SMD,3.0×3.0mm

说明:基于 DCR 的直流损耗示例:若以额定电流 6.3A 连续工作,近似铜损 P = I^2·DCR ≈ 6.3^2×0.019 ≈ 0.75W,设计时应考虑热量管理与散热路径。

四、典型应用

  • 同步/非同步降压(Buck)转换器输出滤波与电感储能
  • 电源管理模块(PMIC)及点到点供电
  • 通信设备、工业控制、消费电子中的高密度电源板
  • 汽车电子(符合对应车规要求时)与电池供电系统

五、选型与使用建议

  • 电流裕度:建议系统设计中给额定电流留有 10–20% 余量,避免长期工作在接近 Isat 的区域导致磁芯饱和或温升过高。
  • 峰值与纹波:关注开关电源中的峰值电流与纹波电流,若纹波较大需评估电感电流纹波对有效电感值与损耗的影响。
  • 温升管理:由于在高电流下损耗可观,建议采用铜箔散热、热过孔或增大周边铜面积以降低结温。
  • 与电容配合:输出侧电解/固态电容与电感应紧邻布局,缩短环路,减小 EMI 与寄生电感。

六、封装与焊接注意事项

  • 推荐采用标准 SMD 回流焊工艺,遵循元件与 PCB 制造商的回流温度曲线(无铅工艺参考 JEDEC 指南)。
  • 贴装时确保焊盘尺寸与厂家推荐一致,避免过量助焊膏导致焊接缺陷或影响机械强度。
  • 由于器件工作时会发热,建议设计时在元件下方或周围留足铜箔散热通道并加入过孔连接至内层/底层散热层。

七、可靠性与测试建议

  • 在样机验证阶段,应进行温升测试、长期老化与电流循环测试,评估在目标工作点的电感衰减与 DCR 变化。
  • 做好饱和边界测试(逐步增加直流偏置并监测电感值),确认在最大瞬态电流下仍有足够的磁通余量。
  • 进行 EMI 测试并根据需要配合布局或滤波器件做抑制。

总结:FTC303020D1R5MBCA 以其 3×3mm 的小型化封装、大电流能力与较低的 DCR,为空间受限但需高效率与高电流通道的电源设计提供了平衡的方案;在实际应用中应重视热管理与电流裕度,以保证长期稳定运行。若需更详细的电气特性曲线、封装图与回流推荐,请向长江微电获取完整规格书。

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